XC6SLX75T-N3FGG676I

The XC6SLX75T-N3FGG676I is a Spartan®-6 LXT field programmable gate array (FPGA) from AMD, supplied in a 676-ball fine-pitch BGA (27 × 27 mm) package. It provides a balanced combination of logic capacity, embedded memory and a high I/O count suitable for industrial-grade embedded designs.

With 74,637 logic elements, approximately 3.17 Mbits of on-chip RAM and 348 I/O pins, this device is positioned for applications that require significant programmable logic, dense I/O connectivity and operation across an extended temperature range.

Key Features

• Logic Capacity  74,637 logic elements for implementing complex custom logic and control functions.
• Embedded Memory  Approximately 3.17 Mbits of on-chip RAM to support buffering, state storage and local data processing.
• I/O Density  348 available I/O pins to accommodate wide peripheral connectivity, parallel interfaces and multi-signal systems.
• Package  676-ball FBGA (27 × 27 mm) surface-mount package for compact, board-level integration.
• Power  Core supply range of 1.14 V to 1.26 V for the programmable logic fabric.
• Operating Temperature  Rated for −40 °C to 100 °C, suitable for industrial temperature environments.
• Mounting  Surface-mount device designed for standard PCB assembly processes.
• Environmental Compliance  RoHS compliant.

Typical Applications

• Industrial Control  Use the industrial temperature rating and high logic capacity to implement custom control algorithms and I/O aggregation for factory automation and machine control systems.
• Embedded Systems  Leverage the combination of embedded memory and logic elements to build custom processing pipelines and protocol bridging within embedded products.
• High‑I/O Interfaces  Deploy the 348 I/O pins for boards requiring dense parallel or multi-channel connectivity, such as sensor arrays or multiport communication modules.

Unique Advantages

• Substantial Logic Resource: 74,637 logic elements enable implementation of large-scale custom logic without immediate need to migrate to higher-end devices.
• On‑Chip Memory: Approximately 3.17 Mbits of embedded RAM reduces dependence on external memory for intermediate buffering and state retention.
• High Connectivity: 348 I/O pins provide flexibility for interfacing with multiple peripherals, sensors and buses directly on the FPGA.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployments in challenging environmental conditions.
• Compact BGA Package: 676-ball FBGA (27 × 27 mm) balances I/O density with a compact PCB footprint for space-constrained designs.
• RoHS Compliant: Conforms to RoHS requirements for environmentally conscious manufacturing and assembly.

Why Choose XC6SLX75T-N3FGG676I?

The XC6SLX75T-N3FGG676I offers a practical mix of logic resources, embedded memory and I/O density in a compact industrial-grade package. It is well-suited for teams needing a programmable platform that supports significant custom logic, local memory storage and extensive peripheral connectivity while operating across an extended temperature range.

Choose this Spartan®-6 LXT FPGA when your design requires scalable programmable logic, reliable operation in industrial environments and the ability to consolidate multiple functions on a single device to simplify system design and reduce bill of materials.

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