XC6SLX75T-N3FGG484I

The XC6SLX75T-N3FGG484I is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) from AMD supplied in a 484‑BBGA package. It provides a combination of programmable logic resources, embedded memory, and a high I/O count suitable for industrial-grade applications.

Key attributes include approximately 74,637 logic elements, roughly 3.17 Mbits of embedded memory, 268 I/O pins, and an industrial operating temperature range, delivering a balance of integration and environmental tolerance for demanding designs.

Key Features

• Core FPGA Architecture Spartan‑6 LXT Field Programmable Gate Array in a 484‑BBGA package, providing a programmable hardware platform for custom logic implementation.
• Logic Resources Approximately 74,637 logic elements with 5,831 CLBs to implement a wide range of combinational and sequential logic functions.
• Embedded Memory Approximately 3.17 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage.
• I/O Capacity 268 I/O pins to support extensive peripheral interfacing and system I/O requirements.
• Supply Voltage Core supply range from 1.14 V to 1.26 V to meet the device's power requirements.
• Industrial Temperature Range Specified for operation from −40 °C to 100 °C to support industrial environments.
• Package and Mounting 484‑BBGA / supplier device package 484‑FBGA (23×23), surface‑mount construction for compact board-level integration.
• Regulatory Compliance RoHS compliant.

Unique Advantages

• High Logic Density: Approximately 74,637 logic elements allow substantial custom logic implementation on a single device, reducing the need for multiple chips.
• Significant On‑Chip Memory: Roughly 3.17 Mbits of embedded RAM provides local storage for buffering and data processing without external memory.
• Extensive I/O: 268 I/O pins enable broad peripheral connectivity and flexible interface options directly from the FPGA.
• Industrial‑Grade Temperature Capability: Rated from −40 °C to 100 °C for use in temperature‑challenging environments.
• Compact Surface‑Mount Package: 484‑BBGA (23×23) package supports dense board designs and automated assembly.
• Regulatory and Supply Readiness: RoHS compliance and a defined core voltage range (1.14 V–1.26 V) simplify integration into compliant system designs.

Why Choose XC6SLX75T-N3FGG484I?

The XC6SLX75T-N3FGG484I positions itself as a versatile Spartan‑6 LXT FPGA option for designs that require a substantial mix of logic resources, on‑chip memory, and high I/O density in a compact, surface‑mount form factor. Its industrial temperature rating and RoHS compliance make it suitable for environmentally demanding applications that also require regulatory conformity.

This device is well suited for engineers and procurement teams seeking an AMD Spartan‑6 LXT FPGA with clear, verifiable specifications for logic capacity, memory, I/O count, package, and operating conditions—supporting scalable, robust designs with predictable integration requirements.

Request a quote or submit an inquiry for pricing and availability of the XC6SLX75T-N3FGG484I to begin specifying this FPGA into your next design.