XC6SLX75T-N3FG484C

The XC6SLX75T-N3FG484C is a Spartan®-6 LXT family FPGA from AMD provided in a 484-BBGA package. It is a commercial-grade, surface-mount programmable logic device that integrates a large logic fabric, substantial on-chip memory, and a high I/O count for designs requiring dense logic and connectivity.

Key hardware characteristics include approximately 74,637 logic elements, about 3.17 Mbits of embedded memory, and 268 user I/O, making it suitable for commercial embedded and system integration applications that operate within a 0 °C to 85 °C range and a 1.14 V to 1.26 V core supply.

Key Features

• Logic Capacity  Approximately 74,637 logic elements for implementing complex combinational and sequential logic structures.
• Embedded Memory  Approximately 3.17 Mbits of on-chip RAM to support data buffering, FIFOs, and distributed storage needs.
• I/O Density  268 user I/O pins to accommodate multiple interfaces, parallel buses, and high-pin-count connectivity requirements.
• Package and Mounting  484-BBGA (supplier package: 484-FBGA 23×23) in a surface-mount form factor suited for compact PCB layouts.
• Power  Core voltage supply range of 1.14 V to 1.26 V to match system power domains and regulator designs.
• Operating Range  Commercial operating temperature range from 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance  RoHS-compliant construction supporting regulatory and environmental requirements.

Typical Applications

• Commercial Embedded Systems  Provides programmable logic and embedded memory for control, signal processing, and subsystem integration in commercial devices.
• I/O-Intensive Designs  The 268 I/O pins enable integration of multiple parallel interfaces, board-level bridging, and multi-channel sensor or actuator connectivity.
• System Prototyping and Integration  Large logic capacity and on-chip RAM support prototyping of complex logic functions and consolidation of glue logic into a single device.

Unique Advantages

• Substantial Logic Resources: Approximately 74,637 logic elements allow implementation of wide-ranging digital functions without immediate upscaling to larger devices.
• Significant On-Chip Memory: About 3.17 Mbits of embedded RAM reduces dependence on external memory for buffering and latency-sensitive storage.
• High I/O Count: 268 user I/O pins facilitate numerous peripheral connections and parallel interfaces, minimizing the need for external I/O expanders.
• Compact BGA Package: 484-BBGA (23×23) supports high-density PCB designs while maintaining a surface-mount assembly flow.
• Commercial Grade: Specified for 0 °C to 85 °C operation and RoHS compliance, aligning with typical commercial product requirements.
• Defined Core Power Range: A core voltage window of 1.14 V to 1.26 V supports integration with common power-supply designs.

Why Choose XC6SLX75T-N3FG484C?

The XC6SLX75T-N3FG484C combines a large logic fabric, appreciable embedded memory, and a high I/O count in a compact 484-BBGA surface-mount package. Its commercial-grade temperature and specified core voltage range make it well suited for designers seeking a balance of integration density and system-level connectivity for commercial embedded and integration projects.

Choose this FPGA when your design requires substantial programmable logic and on-chip RAM with extensive I/O in a RoHS-compliant, surface-mount package—enabling consolidation of functions, reduced external components, and straightforward PCB integration.

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