XC6SLX75T-N3FGG484C

The XC6SLX75T-N3FGG484C is a Spartan®-6 LXT field-programmable gate array (FPGA) IC from AMD, delivered in a 484-BBGA package. It combines substantial logic capacity, embedded memory, and a high I/O count in a compact surface-mount package, with a low-voltage core supply suitable for modern power domains and commercial temperature operation.

Key Features

• Logic Capacity  Approximately 74,637 logic elements, enabling complex combinational and sequential logic implementations.
• Embedded Memory  Approximately 3.17 Mbits of on-chip RAM for buffers, FIFOs and local data storage.
• I/O Count  268 user I/O pins for broad external connectivity and interface options.
• Power  Core supply voltage range of 1.14 V to 1.26 V for low-voltage system integration.
• Package & Mounting  484-BBGA package (supplier device package: 484-FBGA, 23×23) designed for surface-mount PCB assembly.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0°C to 85°C.
• Regulatory  RoHS compliant for environmental substance requirements.

Unique Advantages

• High logic integration: A large pool of logic elements lets you implement sophisticated custom logic while reducing external component count.
• Substantial on-chip memory: Approximately 3.17 Mbits of embedded RAM supports local buffering and state storage, reducing dependence on external memory devices.
• Extensive I/O resources: 268 I/O pins provide flexibility for multiple parallel interfaces and peripheral connections.
• Compact BGA form factor: The 484-BBGA (484-FBGA, 23×23) package provides a space-efficient solution for high-density board designs.
• Low-voltage core: 1.14–1.26 V supply range aligns with contemporary low-voltage system architectures.
• Commercial readiness: Rated for 0°C to 85°C operation and RoHS compliant, supporting mainstream embedded and electronic applications.

Why Choose XC6SLX75T-N3FGG484C?

The XC6SLX75T-N3FGG484C positions itself as a scalable FPGA option for designs that require considerable programmable logic, on-chip memory, and substantial I/O in a compact surface-mount package. Its low-voltage core and commercial temperature specification make it suitable for a wide range of mainstream embedded and electronic products where integration density and board-level space efficiency matter.

Choosing this part provides a balance of logic capacity, embedded RAM, and I/O resources backed by AMD's Spartan®-6 LXT family characteristics, helping teams reduce BOM complexity and streamline system integration.

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