XC6SLX75T-4FGG676C

The XC6SLX75T-4FGG676C is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) from AMD, packaged in a 676-ball BGA (27 × 27) for surface-mount assembly. It delivers a balanced combination of programmable logic, embedded memory and I/O capacity for commercial electronic designs.

This device features 74,637 logic elements, approximately 3.17 Mbits of embedded memory and 348 I/Os, supporting a range of digital and embedded applications that require medium-to-high logic density with a compact package and standard commercial temperature range.

Key Features

• Core Logic 74,637 logic elements provide substantial programmable logic capacity for complex digital functions and custom hardware acceleration.
• Embedded Memory Approximately 3.17 Mbits of on-chip RAM to support buffering, packet storage and on-chip data structures without external memory.
• I/O Capacity 348 user I/Os to interface with external peripherals, sensors and high-speed data channels in compact system designs.
• Power Supply Operates from 1.14 V to 1.26 V supply range, enabling integration into systems with controlled core-voltage domains.
• Package & Mounting 676-FBGA (27 × 27) package in a 676-BGA footprint designed for surface-mount assembly to save board area and support high-density routing.
• Operating Temperature & Grade Commercial-grade device rated for 0 °C to 85 °C operation, suitable for a wide range of non-industrial applications.
• Environmental Compliance RoHS-compliant construction to meet common regulatory and assembly requirements.

Typical Applications

• Commercial Embedded Systems Use the FPGA for custom logic, protocol bridging and control functions in commercial electronics operating within the 0 °C to 85 °C range.
• Data Interface and Connectivity Utilize the 348 I/Os for implementing parallel and serial interfaces between system components and external peripherals.
• On-board Acceleration Deploy logic elements and embedded memory to offload compute-intensive or timing-critical tasks from host processors.

Unique Advantages

• High Logic Capacity: 74,637 logic elements enable substantial custom logic implementation without immediate need for higher-tier devices.
• On-chip Memory: Approximately 3.17 Mbits of embedded RAM reduce dependence on external memory for many buffering and state-storage needs.
• Large I/O Count: 348 I/Os provide flexibility to connect multiple peripherals and interfaces directly to the FPGA.
• Compact BGA Package: 676-FBGA (27 × 27) footprint supports high-density PCB layouts while maintaining a surface-mount assembly flow.
• Commercial Temperature Support: Rated for 0 °C to 85 °C, suited to a broad set of commercial applications and environments.
• Regulatory Readiness: RoHS-compliant construction simplifies integration into lead-free manufacturing processes.

Why Choose XC6SLX75T-4FGG676C?

The XC6SLX75T-4FGG676C positions itself as a versatile, commercial-grade Spartan®-6 LXT FPGA offering a balanced mix of logic density, embedded memory and high I/O count in a compact 676-BGA package. Its power supply range and RoHS compliance make it practical for contemporary commercial electronics where board area and integration matter.

This device is appropriate for designers and procurement teams seeking a programmable logic solution for commercial embedded systems, on-board acceleration and complex I/O integration, backed by AMD's Spartan-6 family lineage and ecosystem resources.

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