XC6SLX75T-N3CSG484I

The XC6SLX75T-N3CSG484I is a Spartan®-6 LXT field programmable gate array presented in a 484-ball FBGA / CSPBGA package. It provides a high-capacity FPGA fabric with 74,637 logic elements and approximately 3.17 Mbits of embedded memory, suitable for industrial applications that require on-chip memory and significant I/O support.

This device supports a wide operating temperature range (−40 °C to 100 °C) and a 1.14 V to 1.26 V core supply range, packaged as a 484-CSPBGA (19×19) surface-mount device for compact system integration.

Key Features

• FPGA Core  74,637 logic elements provide substantial programmable logic capacity for complex digital functions.
• Embedded Memory  Approximately 3.17 Mbits of on-chip RAM to support buffers, FIFOs, and local data storage without external memory.
• I/O Density  Up to 292 I/O pins to support multiple interfaces, parallel buses, and dense signal connectivity.
• Package and Mounting  484-CSPBGA (19×19) / 484-FBGA package designed for surface-mount assembly, enabling compact board layouts.
• Power  Core voltage range of 1.14 V to 1.26 V to match typical FPGA power domains and system power rails.
• Temperature and Grade  Industrial grade device with an operating temperature range from −40 °C to 100 °C for use in thermally demanding environments.
• Compliance  RoHS compliant, supporting regulatory and environmental requirements for lead-free assembly.

Typical Applications

• Industrial Control Systems  Use the device’s logic capacity, on-chip memory, and 292 I/O to implement control logic, timing, and interface functions in industrial environments within the specified temperature range.
• Data Buffering and Interface Bridging  Embedded RAM and abundant I/O allow implementation of protocol conversion, buffering, and parallel/serial interface bridging on a single FPGA.
• Embedded Processing and Custom Logic  Implement custom processing blocks, state machines, and peripheral controllers leveraging the available logic elements and memory.

Unique Advantages

• High Logic Density: 74,637 logic elements enable complex custom logic and multiple concurrent functions without external CPLDs or discrete logic.
• Integrated On‑Chip Memory: Approximately 3.17 Mbits of embedded RAM reduces dependence on external memory and simplifies board design.
• Extensive I/O Resources: 292 I/O pins provide flexibility for multiple interfaces and high-pin-count systems.
• Industrial Temperature Range: Rated from −40 °C to 100 °C to support deployment in industrial applications requiring extended temperature operation.
• Compact Surface-Mount Package: 484-CSPBGA (19×19) package offers a space-efficient form factor for dense PCBs.
• RoHS Compliant: Enables lead-free manufacturing and simplifies environmental compliance.

Why Choose XC6SLX75T-N3CSG484I?

The XC6SLX75T-N3CSG484I delivers a balance of logic capacity, embedded memory, and extensive I/O in a compact 484-ball CSPBGA/FBGA package. Its industrial-grade temperature rating and RoHS compliance make it a practical choice for industrial and embedded designs that require on-chip resources and reliable operation across a wide temperature range.

This part is suited for engineers and procurement teams looking for a high-density FPGA solution that supports complex custom logic, local memory needs, and dense I/O while maintaining a small PCB footprint and compliance for lead-free assembly.

Request a quote or submit an inquiry today to get pricing and availability for the XC6SLX75T-N3CSG484I and evaluate it for your next design.