XC6SLX75T-3FGG676I

The XC6SLX75T-3FGG676I is a Spartan® 6 LXT field programmable gate array (FPGA) from AMD supplied in a 676-BGA package. It combines a substantial logic capacity with on-chip block RAM and a broad I/O complement suitable for space-constrained, performance-oriented embedded designs.

With an industrial operating temperature range and a low-voltage core supply window, this device is positioned for industrial and embedded applications that require moderate-density programmable logic, flexible I/O counts, and robust environmental operation.

Key Features

• Logic Capacity — 74,637 logic elements to implement custom digital functions and moderate-complexity designs.
• Configurable Logic Blocks — 5,831 CLBs for structuring combinational and sequential logic across the fabric.
• On-chip Memory — Approximately 3.17 Mbits of embedded memory to support buffering, FIFOs, and local data storage.
• I/O Resources — 348 user I/O pins for interfacing with peripherals, sensors, and external devices.
• Power — Core voltage supply range of 1.14 V to 1.26 V for platform power planning and regulator selection.
• Package & Mounting — 676-FBGA (27×27) package in a surface-mount form factor for compact PCB implementations.
• Temperature Range — Industrial-grade operation from −40°C to 100°C for temperature-demanding environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Use the industrial temperature rating and abundant I/O to implement sensor interfacing, motor control logic, and custom protocol handling.
• Embedded Systems — Leverage the on-chip memory and logic resources for embedded accelerators, data path processing, and interface bridging in compact systems.
• Communications Equipment — Deploy logic capacity and high I/O counts for protocol adaptation, packet buffering, and control-plane functions.
• Industrial Instrumentation — Integrate with measurement and acquisition front ends where durable operation and configurable logic are required.

Unique Advantages

• Substantial Logic Density: 74,637 logic elements provide room for implementing moderately complex custom logic without moving to larger device families.
• Integrated On‑Chip Memory: Approximately 3.17 Mbits of embedded RAM reduce external memory dependency for many buffering and temporary storage needs.
• High I/O Count: 348 I/O pins enable flexible interfacing with multiple peripherals and high-pin-count connectors.
• Industrial Temperature Capability: Rated from −40°C to 100°C to support deployments in harsher thermal environments.
• Compact BGA Footprint: 676-FBGA (27×27) surface-mount package balances I/O density with PCB area efficiency.
• Controlled Core Voltage Range: 1.14 V to 1.26 V supply window assists in predictable power supply design and thermal planning.

Why Choose XC6SLX75T-3FGG676I?

Produced by AMD, the XC6SLX75T-3FGG676I Spartan® 6 LXT FPGA offers a well-rounded mix of logic capacity, embedded memory, and I/O density in a surface-mount 676-BGA package. Its industrial temperature rating and RoHS compliance make it suitable for a range of embedded and industrial applications where reliable operation across temperature and a compact footprint are important.

This device is a good fit for designers seeking a moderate-density programmable logic solution that balances integration and board-level efficiency. Its combination of logic elements, on-chip RAM, and numerous I/Os supports scalable designs and reduces the need for external components, contributing to long-term design robustness and maintainability.

Request a quote or submit an inquiry to receive pricing and availability details for the XC6SLX75T-3FGG676I Spartan® 6 LXT FPGA. Our team can assist with lead times and ordering information.