XC6SLX75T-3FGG484C
| Part Description |
Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 268 3170304 74637 484-BBGA |
|---|---|
| Quantity | 462 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 268 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5831 | Number of Logic Elements/Cells | 74637 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3170304 |
Overview of XC6SLX75T-3FGG484C – Spartan®-6 LXT FPGA, 484-BBGA, Commercial
The XC6SLX75T-3FGG484C is a Spartan®-6 LXT field-programmable gate array (FPGA) IC delivered in a 484-BBGA package. It offers a balance of logic capacity, embedded memory and I/O density for commercial embedded and digital designs.
Key device attributes include approximately 74,637 logic elements, roughly 3.17 Mbits of on-chip RAM, 268 user I/O pins, and a low-voltage supply range of 1.14 V to 1.26 V. The device is specified for surface-mount assembly and commercial operation from 0 °C to 85 °C and is RoHS compliant.
Key Features
- Core Architecture Spartan®-6 LXT FPGA family device providing reprogrammable digital logic resources for custom logic implementation.
- Logic Capacity Approximately 74,637 logic elements to implement complex combinational and sequential logic functions.
- Embedded Memory Total on-chip RAM of 3,170,304 bits (approximately 3.17 Mbits) for data buffering, FIFOs and small memory structures.
- I/O Resources 268 user I/O pins to support wide external interfacing and parallel connectivity.
- Power Device core supply specified between 1.14 V and 1.26 V to match targeted system power rails.
- Package & Mounting 484-ball BGA package (supplier device package: 484-FBGA, 23×23) optimized for surface-mount assembly on compact PCBs.
- Operating Range & Grade Commercial grade device rated for 0 °C to 85 °C operation.
- Environmental Compliance RoHS compliant.
Unique Advantages
- High logic density: Approximately 74,637 logic elements allow implementation of sizeable custom logic functions within a single FPGA device.
- Substantial on-chip RAM: About 3.17 Mbits of embedded memory supports local buffering and intermediate data storage without external RAM.
- Generous I/O count: 268 user I/Os provide flexibility for interfacing to multiple peripherals, parallel busses or wide data paths.
- Compact BG A packaging: 484-BBGA (23×23) enables higher board-level density while supporting surface-mount assembly processes.
- Low-voltage core operation: Narrow supply range (1.14 V to 1.26 V) simplifies power-rail planning for systems using low-voltage digital domains.
- Commercial temperature rating: Specified 0 °C to 85 °C operation for standard commercial electronics applications.
Why Choose XC6SLX75T-3FGG484C?
The XC6SLX75T-3FGG484C positions itself as a balanced, reprogrammable logic device for commercial embedded designs that require a mix of logic capacity, embedded memory and substantial I/O connectivity. Its Spartan®-6 LXT architecture and package choices make it suitable for compact board designs that need significant on-chip resources without multiple discrete components.
This part is appropriate for engineers and procurement teams seeking a single-device solution with approximately 74,637 logic elements, about 3.17 Mbits of embedded RAM, and 268 I/Os, all in a surface-mount 484-BBGA package. The commercial temperature rating and RoHS compliance provide clear parameters for deployment in standard electronic products.
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