XC6SLX75T-3FGG484C

IC FPGA 268 I/O 484FBGA
Part Description

Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 268 3170304 74637 484-BBGA

Quantity 462 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O268Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5831Number of Logic Elements/Cells74637
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3170304

Overview of XC6SLX75T-3FGG484C – Spartan®-6 LXT FPGA, 484-BBGA, Commercial

The XC6SLX75T-3FGG484C is a Spartan®-6 LXT field-programmable gate array (FPGA) IC delivered in a 484-BBGA package. It offers a balance of logic capacity, embedded memory and I/O density for commercial embedded and digital designs.

Key device attributes include approximately 74,637 logic elements, roughly 3.17 Mbits of on-chip RAM, 268 user I/O pins, and a low-voltage supply range of 1.14 V to 1.26 V. The device is specified for surface-mount assembly and commercial operation from 0 °C to 85 °C and is RoHS compliant.

Key Features

  • Core Architecture  Spartan®-6 LXT FPGA family device providing reprogrammable digital logic resources for custom logic implementation.
  • Logic Capacity  Approximately 74,637 logic elements to implement complex combinational and sequential logic functions.
  • Embedded Memory  Total on-chip RAM of 3,170,304 bits (approximately 3.17 Mbits) for data buffering, FIFOs and small memory structures.
  • I/O Resources  268 user I/O pins to support wide external interfacing and parallel connectivity.
  • Power  Device core supply specified between 1.14 V and 1.26 V to match targeted system power rails.
  • Package & Mounting  484-ball BGA package (supplier device package: 484-FBGA, 23×23) optimized for surface-mount assembly on compact PCBs.
  • Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operation.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • High logic density: Approximately 74,637 logic elements allow implementation of sizeable custom logic functions within a single FPGA device.
  • Substantial on-chip RAM: About 3.17 Mbits of embedded memory supports local buffering and intermediate data storage without external RAM.
  • Generous I/O count: 268 user I/Os provide flexibility for interfacing to multiple peripherals, parallel busses or wide data paths.
  • Compact BG A packaging: 484-BBGA (23×23) enables higher board-level density while supporting surface-mount assembly processes.
  • Low-voltage core operation: Narrow supply range (1.14 V to 1.26 V) simplifies power-rail planning for systems using low-voltage digital domains.
  • Commercial temperature rating: Specified 0 °C to 85 °C operation for standard commercial electronics applications.

Why Choose XC6SLX75T-3FGG484C?

The XC6SLX75T-3FGG484C positions itself as a balanced, reprogrammable logic device for commercial embedded designs that require a mix of logic capacity, embedded memory and substantial I/O connectivity. Its Spartan®-6 LXT architecture and package choices make it suitable for compact board designs that need significant on-chip resources without multiple discrete components.

This part is appropriate for engineers and procurement teams seeking a single-device solution with approximately 74,637 logic elements, about 3.17 Mbits of embedded RAM, and 268 I/Os, all in a surface-mount 484-BBGA package. The commercial temperature rating and RoHS compliance provide clear parameters for deployment in standard electronic products.

Request a quote or submit an inquiry to purchase the XC6SLX75T-3FGG484C and receive pricing and availability information for your design needs.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1969


    Headquarters: Santa Clara, California, USA


    Employees: 25,000+


    Revenue: $22.68 Billion


    Certifications and Memberships: ISO9001:2015, RoHS, REACH


    Featured Products
    Latest News
    keyboard_arrow_up