XC6SLX75T-3FG484I

The XC6SLX75T-3FG484I is a Spartan®-6 LXT field programmable gate array (FPGA) provided in a 484-ball BGA package. It offers a balance of programmable logic density, on-chip memory, and I/O resources for industrial-grade embedded applications.

Designed for surface-mount assembly, this device operates from a core supply range of 1.14 V to 1.26 V and supports an industrial temperature range of −40 °C to 100 °C, making it suited to environments that require extended temperature tolerance.

Key Features

• Logic Capacity — Contains 5,831 configurable logic blocks (CLBs) and 74,637 logic elements to implement custom digital functions and state machines.
• Embedded Memory — Approximately 3.17 Mbits of on-chip RAM for buffering, FIFOs, and small data stores directly within the FPGA fabric.
• I/O Resources — 268 general-purpose I/O pins to support multiple interfaces and parallel connections to peripherals or interfaces.
• Power — Core voltage supply range of 1.14 V to 1.26 V for predictable power provisioning and board-level power design.
• Package — 484-ball BGA package (supplier device package: 484-FBGA, 23×23) optimized for compact, high-density PCB layouts and surface-mount assembly.
• Temperature and Grade — Industrial-grade device rated for operation from −40 °C to 100 °C, suitable for applications requiring extended temperature performance.
• RoHS Compliance — Environmentally compliant with RoHS requirements.

Typical Applications

• Industrial Control — Implements custom control logic, motor control sequencing, and deterministic I/O handling within industrial temperature envelopes.
• Embedded Processing — Provides on-chip programmable logic and memory for glue logic, protocol bridging, and hardware acceleration in embedded systems.
• High-Density I/O Systems — Supports boards that require many parallel or multiplexed I/O signals thanks to its 268 I/O pins and compact BGA footprint.

Unique Advantages

• Substantial Logic Resources: 74,637 logic elements and 5,831 CLBs enable implementation of complex digital designs without external gate arrays.
• On-Chip Memory: Approximately 3.17 Mbits of embedded RAM reduces the need for external memory for buffering and small data stores.
• Robust I/O Count: 268 I/O pins provide flexibility for multiple interfaces and high-pin-count peripherals.
• Industrial Temperature Rating: −40 °C to 100 °C operation supports deployment in environments with extended temperature requirements.
• Compact BGA Package: 484-ball BGA (23×23) supports high-density board designs while enabling surface-mount assembly.
• RoHS Compliant: Conforms to RoHS standards for environmentally conscious designs.

Why Choose XC6SLX75T-3FG484I?

The XC6SLX75T-3FG484I positions itself as a flexible, industrial-grade Spartan®-6 LXT FPGA suited to designers who need substantial programmable logic, on-chip memory, and a large I/O set in a compact BGA package. Its specified core voltage range and extended operating temperature make it appropriate for embedded systems that require stable operation across varied environmental conditions.

This device is well matched to teams building control systems, embedded processing modules, and high-density I/O boards that benefit from integrated memory and programmable logic. Its combination of logic capacity, memory, I/O, and package density offers a scalable platform for medium-complexity FPGA designs.

Request a quote or submit an inquiry to receive pricing and availability for the XC6SLX75T-3FG484I for your next design project.