XC6SLX75T-2FGG676C

The XC6SLX75T-2FGG676C is a Spartan®-6 LXT Field Programmable Gate Array supplied in a 676-FBGA (27×27) package. It delivers a balance of programmable logic, embedded memory, and high I/O count for commercial-grade applications.

With 74,637 logic elements, approximately 3.17 Mbits of embedded memory and 348 user I/O, this device is suited to designs that require substantial on-chip resources in a compact surface-mount BGA package. It operates from a core voltage range of 1.14 V to 1.26 V and supports an operating temperature range of 0 °C to 85 °C.

Key Features

• Core Logic  Approximately 74,637 logic elements provide substantial programmable logic capacity for mid-range FPGA designs.
• Embedded Memory  Approximately 3.17 Mbits of on-chip RAM to support buffering, state storage, and temporary data structures.
• I/O Resources  348 user I/O pins enable broad connectivity for parallel interfaces, control signals, and peripheral access.
• Package and Mounting  676-FBGA (27×27) package in a surface-mount form factor for compact board-level integration.
• Power  Core voltage supply range from 1.14 V to 1.26 V for defined power budgeting and supply design.
• Temperature and Grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Compliance  RoHS-compliant manufacturing status.

Typical Applications

• High-density I/O systems  Utilize the 348 user I/O pins for designs that require broad interfacing to sensors, peripherals, or parallel busses.
• Embedded memory–dependent logic  Leverage approximately 3.17 Mbits of on-chip RAM for buffering, data aggregation, and state machines.
• Compact, board-level FPGA integration  The 676-FBGA (27×27) surface-mount package fits space-constrained PCBs while providing substantial logic resources.
• Commercial electronic systems  Designed for commercial temperature operation, suitable for a wide range of standard embedded and instrumentation products.

Unique Advantages

• High logic capacity: Approximately 74,637 logic elements enable complex combinational and sequential designs without external glue logic.
• Significant on-chip memory: Approximately 3.17 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage tasks.
• Extensive I/O availability: 348 user I/O pins support flexible interfacing and reduce the need for additional I/O expander components.
• Compact BGA package: 676-FBGA (27×27) provides a high-density, surface-mount footprint for space-efficient PCB layouts.
• Defined power envelope: Narrow core voltage range (1.14 V to 1.26 V) facilitates predictable power-supply design and decoupling strategy.
• RoHS-compliant and commercial grade: Compliance and commercial temperature rating simplify regulatory considerations for standard electronics applications.

Why Choose XC6SLX75T-2FGG676C?

The XC6SLX75T-2FGG676C positions itself as a capable, commercially graded Spartan®-6 LXT FPGA that combines a high count of logic elements, meaningful embedded memory, and an extensive I/O set in a compact 676-FBGA package. These attributes make it suitable for teams building mid-range programmable logic solutions where board space, I/O density, and on-chip memory are primary considerations.

For designers and procurement teams seeking a FPGA with defined electrical and thermal operating points—1.14 V to 1.26 V core voltage and 0 °C to 85 °C operating temperature—this device offers a clear set of verifiable capabilities, along with RoHS compliance for standard commercial deployments.

Request a quote or submit your requirements to receive pricing and availability information for the XC6SLX75T-2FGG676C today.