XC6SLX75T-2FG676I

The XC6SLX75T-2FG676I is an AMD Spartan®-6 LXT Field Programmable Gate Array supplied in a 676-ball BGA package. It delivers a combination of mid-range logic capacity, embedded memory, and a high I/O count suitable for industrial applications that require extended temperature operation and surface-mount packaging.

Key on-chip resources include 74,637 logic elements, approximately 3.17 Mbits of embedded memory, and 348 user I/O pins. The device operates from a core voltage range of 1.14 V to 1.26 V and is specified for operation from -40 °C to 100 °C.

Key Features

• Logic Capacity — 74,637 logic elements provide substantial programmable resources for mid-range digital logic implementations and custom processing tasks.
• Configurable Logic Blocks — 5,831 logic blocks (CLBs) for building complex programmable logic structures and implementing parallel processing architectures.
• Embedded Memory — Approximately 3.17 Mbits of on-chip RAM to support buffering, state machines, and data-path storage without external memory dependence.
• I/O Density & Package — 348 user I/O pins in a 676-FBGA (27×27) package, delivered as a 676-BGA package case suitable for high-density PCB designs and surface-mount assembly.
• Power — Core supply voltage range of 1.14 V to 1.26 V for the FPGA core.
• Industrial Temperature Range — Rated for operation from -40 °C to 100 °C to meet thermal requirements of industrial environments.
• Mounting & Form Factor — Surface mount device with a compact 676-BGA footprint to support space-constrained designs.
• Compliance — RoHS compliant for environmental and regulatory considerations.

Typical Applications

• Industrial Control — Suitable for control logic and I/O aggregation in systems that require -40 °C to 100 °C operation and industrial-grade components.
• Embedded Processing — Mid-range logic capacity and on-chip RAM make the device appropriate for custom data-paths, protocol processing, and peripheral bridging.
• High-Density I/O Interfaces — 348 I/O pins support designs with extensive sensor, actuator, or communication interface requirements.
• Prototyping and System Integration — Surface-mount 676-BGA package and substantial programmable resources enable integration into compact prototype and production PCBs.

Unique Advantages

• Balanced Logic and Memory: With 74,637 logic elements and approximately 3.17 Mbits of embedded memory, the device supports complex logic and data buffering without immediate reliance on external memory.
• High I/O Count in Compact Package: 348 user I/Os in a 676-FBGA (27×27) package provide a high signal density while maintaining a compact surface-mount footprint.
• Industrial Temperature Rating: Specified for -40 °C to 100 °C operation, enabling deployment in demanding environments where extended temperature range is required.
• Low-Voltage Core Operation: Core supply range of 1.14 V to 1.26 V aligns the device with low-voltage system designs and power management strategies.
• RoHS Compliant: Environmentally compliant manufacturing standard supports regulatory requirements for many end products.

Why Choose XC6SLX75T-2FG676I?

The XC6SLX75T-2FG676I positions itself as a capable mid-range Spartan®-6 LXT FPGA offering a practical mix of logic density, embedded memory, and extensive I/O in a compact 676-BGA footprint. Its industrial temperature rating and RoHS compliance make it appropriate for production deployments where environmental robustness and regulatory compliance matter.

This device is well suited to engineers and designers building industrial control systems, embedded processing modules, and I/O-rich interfaces who need a programmable, surface-mount FPGA backed by AMD's Spartan®-6 family specifications. The combination of on-chip resources and package density supports scalable designs and integration into space-constrained PCBs.

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