XC6SLX75-N3FGG676I

The XC6SLX75-N3FGG676I is a Spartan®-6 LX field programmable gate array (FPGA) in a 676-ball BGA package designed for surface-mount assembly. It provides a balance of programmable logic, on-chip memory, and a large number of I/O for embedded digital designs.

With 74,637 logic elements and approximately 3.17 Mbits of embedded RAM, this industrial‑grade device supports complex custom logic implementations while operating across a supply range of 1.14 V to 1.26 V and an ambient temperature range of −40 °C to 100 °C.

Key Features

• Programmable Logic — 74,637 logic elements provide substantial capacity for custom logic, state machines, and datapath integration.
• Configurable Logic Blocks — 5,831 CLBs (as specified) to organize and implement logic functions efficiently.
• Embedded Memory — Approximately 3.17 Mbits of on-chip RAM to support buffering, FIFOs, and temporary data storage without external memory.
• I/O Density — 408 user I/O pins to support wide bus interfaces, multiple peripherals, and high pin-count connectivity.
• Power — Core supply range of 1.14 V to 1.26 V to match system power rails and support stable operation.
• Package and Mounting — 676-ball FBGA package (27 × 27 mm) optimized for surface-mount assembly and compact board layouts.
• Industrial Temperature Range — Rated for −40 °C to 100 °C operation for deployment in temperature‑challenging environments.
• RoHS Compliant — Conforms to RoHS requirements for material and environmental compliance.

Typical Applications

• Custom Digital Systems — Implement application‑specific logic, protocol engines, and state machines using the device’s large logic element count.
• I/O Expansion and Bridging — Use the 408 I/O pins for parallel interfaces, bus bridging, or consolidating multiple peripheral connections.
• On‑chip Memory Buffers — Leverage approximately 3.17 Mbits of embedded RAM for buffering, packet queues, or intermediate data storage.
• Industrial Control — Industrial-grade temperature rating and robust package make it suitable for control and automation applications requiring extended operating ranges.

Unique Advantages

• Substantial Logic Capacity: 74,637 logic elements enable implementation of complex functions without external processors.
• Significant Embedded RAM: Approximately 3.17 Mbits of on-chip memory reduces dependence on external memory components and simplifies PCB design.
• High I/O Count: 408 I/O pins support broad peripheral connectivity and flexible interface design options.
• Industrial Temperature Support: −40 °C to 100 °C rating allows deployment in temperature-sensitive environments.
• Compact BGA Packaging: 676-FBGA (27 × 27 mm) enables dense board layouts while supporting surface‑mount manufacturing.
• RoHS Compliance: Meets environmental material requirements for modern electronic designs.

Why Choose XC6SLX75-N3FGG676I?

The XC6SLX75-N3FGG676I positions itself as a versatile, industrial‑grade FPGA that combines a high logic element count, substantial embedded memory, and a large number of I/Os in a compact 676-BGA package. These attributes make it an effective choice for designers needing on-chip resources for custom logic, buffering, and interface consolidation while maintaining a robust operating temperature range.

This device is well suited to engineers and teams building medium-to-high complexity FPGA-based systems who require clear, verifiable specifications for logic capacity, memory, I/O, power, and packaging to support scalable, reliable designs.

Request a quote or submit an inquiry to our sales team for pricing, lead times, and availability of the XC6SLX75-N3FGG676I.