XC6SLX75-N3FG676I

The XC6SLX75-N3FG676I is an AMD Spartan®-6 LX field programmable gate array (FPGA) supplied in a 676-ball fine-pitch BGA package. It provides a balance of on-chip logic, embedded memory and I/O density for programmable logic tasks in industrial applications.

With support for an industrial operating temperature range and a low voltage core supply, this device is suited to designs that require robust operation across temperature extremes, a high number of I/O connections, and substantial on-chip RAM and logic resources.

Key Features

• Logic Capacity — Approximately 74,637 logic elements to implement custom digital functions and control logic.
• Embedded Memory — Approximately 3.17 Mbits of on-chip RAM for data buffering, LUTs and small FIFOs.
• I/O Resources — 408 user I/O pins to interface with sensors, processors, memory and peripheral components.
• Power — Core voltage supply range of 1.14 V to 1.26 V for the device core.
• Packaging — 676-FBGA (27×27) footprint (676-ball BGA) in a surface-mount package for high-density board layouts.
• Temperature Range — Industrial operating temperature from −40 °C to 100 °C for deployment in demanding environments.
• Mounting — Surface mount device suitable for standard PCB assembly processes.
• Environmental Compliance — RoHS compliant.

Typical Applications

• Industrial Control — Implement control logic, I/O aggregation and protocol bridging while operating across industrial temperature ranges.
• Embedded Processing — Provide programmable glue logic, peripheral interfacing and custom state machines using the available logic elements and on-chip RAM.
• Data Buffering and Signal Conditioning — Use embedded RAM alongside plentiful I/O to buffer and format sensor or peripheral data streams.
• Prototype and Custom Hardware — Rapidly iterate hardware functions and integrate custom IP within the FPGA fabric for proof-of-concept or low-volume products.

Unique Advantages

• Substantial Logic Resources: Approximately 74,637 logic elements enable complex combinational and sequential designs without immediate need for external logic.
• Integrated On-Chip Memory: About 3.17 Mbits of embedded RAM reduces dependence on external memory for small to medium buffering tasks.
• High I/O Count: 408 user I/O pins allow flexible interfacing with multiple peripherals and buses, simplifying board-level routing.
• Industrial Temperature Rating: Rated from −40 °C to 100 °C to support deployment in temperature-critical industrial environments.
• Compact, High-Density Package: 676-FBGA (27×27) ball grid array enables space-efficient placement on high-density PCBs.
• RoHS Compliance: Environmentally compliant for regions and projects requiring lead-free components.

Why Choose XC6SLX75-N3FG676I?

The XC6SLX75-N3FG676I combines a substantial logic element count, embedded RAM and a high I/O count in a compact 676-FBGA package engineered for industrial-temperature operation. It is well suited for engineers and procurement teams seeking a programmable solution that balances integration and environmental robustness for control, embedded processing and data buffering tasks.

Designs that require flexible, on-board programmable logic with sizable memory and broad interfacing options can leverage this Spartan-6 LX device to consolidate functions, reduce external component count and maintain operation across a wide temperature range.

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