XC6SLX75-N3FG484C

The XC6SLX75-N3FG484C is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC manufactured by AMD. It provides a programmable logic fabric with 74,637 logic elements and approximately 3.17 Mbits of embedded memory to implement custom digital functions.

Designed for surface-mount assembly in a 484-BBGA / 484-FBGA (23x23) package, the device supports up to 280 I/O and operates from a 1.14 V to 1.26 V supply within a commercial temperature range of 0°C to 85°C. The part is RoHS compliant.

Key Features

• Logic Capacity  The device provides 74,637 logic elements for implementing complex combinational and sequential logic.
• Embedded Memory  Approximately 3.17 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• I/O Density  Up to 280 general-purpose I/O pins to interface with peripherals, sensors, and external memory or logic.
• Power Supply  Operates from a core voltage range of 1.14 V to 1.26 V, enabling predictable power budgeting in system designs.
• Package and Mounting  Available in a 484-BBGA package (listed as 484-FBGA (23x23) by the supplier), optimized for surface-mount PCB assembly.
• Commercial Temperature Grade  Rated for operation from 0°C to 85°C for typical commercial application environments.
• Regulatory  RoHS compliant to support lead-free assembly processes.

Typical Applications

• Embedded Systems  Use the programmable logic and on-chip RAM to implement custom control, data handling, and signal processing functions in embedded designs.
• Prototyping and Development  Leverage the substantial logic capacity and I/O count for hardware prototyping, algorithm validation, and system integration tasks.
• Custom Digital Interfaces  Implement bespoke interface logic and protocol bridging using the device’s I/O resources and programmable fabric.

Unique Advantages

• High Logic Density: 74,637 logic elements enable sizeable custom digital designs without external CPLDs or gate arrays.
• Significant On-Chip Memory: Approximately 3.17 Mbits of embedded RAM reduces dependence on external memory for many buffering and state storage needs.
• Generous I/O Count: 280 I/O pins provide flexibility for multi-channel interfaces, sensors, and peripheral connectivity.
• Compact Surface-Mount Package: 484-BBGA / 484-FBGA (23x23) packaging supports dense PCB layouts while maintaining high pin count.
• Commercial Temperature Suitability: Rated 0°C to 85°C for typical commercial applications and environments.
• RoHS Compliant: Supports lead-free assembly and meets regulatory expectations for many production workflows.

Why Choose XC6SLX75-N3FG484C?

The XC6SLX75-N3FG484C positions itself as a capable Spartan-6 LX FPGA for designs that require substantial programmable logic, moderate on-chip memory, and a high number of I/O in a compact surface-mount package. Its specification set — including 74,637 logic elements, approximately 3.17 Mbits of embedded RAM, and 280 I/O — makes it suitable for teams implementing custom digital functions, interface logic, and prototype systems within commercial temperature ranges.

Manufactured by AMD and offered in a 484-BBGA / 484-FBGA (23x23) package, this RoHS-compliant FPGA provides a balance of integration and I/O capability for developers and procurement teams focused on robust, reproducible hardware designs.

Request a quote or submit a procurement inquiry to receive pricing, availability, and ordering information for the XC6SLX75-N3FG484C.