XC6SLX75-N3CSG484C

The XC6SLX75-N3CSG484C is a Spartan®-6 LX field programmable gate array (FPGA) from AMD, supplied in a 484-ball CSPBGA/FBGA package. It provides a substantial on-chip fabric including approximately 74,637 logic elements, around 3.17 Mbits of embedded memory, and up to 328 I/O, making it suitable for designs that require significant logic density and I/O connectivity within a compact surface-mount package.

Key Features

• Core Logic Approximately 74,637 logic elements available for implementing custom digital logic and state machines.
• Embedded Memory Approximately 3.17 Mbits of on-chip RAM for buffering, FIFOs, and data storage close to the logic.
• I/O Density Up to 328 user I/O pins to support multiple peripherals, interfaces, and parallel data paths.
• Power Supported supply voltage range from 1.14 V to 1.26 V for core power planning and regulator selection.
• Package 484-ball FBGA / CSPBGA package, specified as 484-CSPBGA (19×19), optimized for space-constrained surface-mount designs.
• Temperature & Mounting Commercial-grade operation from 0 °C to 85 °C with surface-mount mounting type.
• Compliance RoHS-compliant manufacturing status for regulatory alignment in standard commercial products.

Typical Applications

• Embedded Control Implement complex control logic, state machines, and custom peripherals where on-chip logic and memory reduce external components.
• Data Interfacing Support high-pin-count interface designs—parallel buses, custom I/O, and multi-peripheral connectivity—taking advantage of up to 328 I/O.
• Signal Processing Deploy on-chip memory and logic for buffering, packet handling, and intermediate data processing tasks.
• Prototyping and System Integration Use the device to validate digital architectures and consolidate multiple functions into a single FPGA package.

Unique Advantages

• High Logic Capacity: Approximately 74,637 logic elements enable implementation of large or multiple concurrent digital functions on a single device.
• Substantial On-Chip Memory: Around 3.17 Mbits of embedded RAM reduce dependency on external memory for many buffering and storage needs.
• Generous I/O Count: Up to 328 I/O pins afford flexible interfacing options for multi-channel and mixed-signal front ends.
• Compact Surface-Mount Package: 484-CSPBGA (19×19) offers a high-pin-count solution in a compact footprint suitable for space-constrained boards.
• Commercial Temperature Range: Rated for 0 °C to 85 °C operation to support standard commercial applications and environments.
• RoHS Compliant: Manufactured to meet RoHS requirements for lead-free designs and regulatory compliance.

Why Choose XC6SLX75-N3CSG484C?

The XC6SLX75-N3CSG484C balances significant logic and memory resources with a high I/O count in a compact 484-ball CSPBGA/FBGA package, making it well suited to commercial embedded designs that require on-chip integration and flexible interfacing. Its specified core voltage range and commercial operating temperature make it appropriate for a wide range of standard electronic products.

As an AMD Spartan®-6 LX device, it offers designers a platform with clear, verifiable specifications—logic capacity, embedded RAM, I/O availability, package details, and RoHS status—supporting predictable hardware planning and BOM definition.

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