XC6SLX75-L1FGG484C

IC FPGA 280 I/O 484FBGA
Part Description

Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 280 3170304 74637 484-BBGA

Quantity 772 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BBGANumber of I/O280Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5831Number of Logic Elements/Cells74637
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3170304

Overview of XC6SLX75-L1FGG484C – Spartan®-6 LX FPGA, 484-BBGA

The XC6SLX75-L1FGG484C is a Spartan®-6 LX field programmable gate array (FPGA) IC from AMD, supplied in a 484-BBGA package. It provides a mid-range, programmable logic platform with substantial logic capacity, embedded memory, and a large number of I/O pins for flexible system integration.

This device is surface-mount packaged and designed for commercial-grade applications, operating across a 0 °C to 85 °C range with a core supply voltage between 1.14 V and 1.26 V. Its combination of logic elements, embedded memory, and I/O count supports a broad set of digital design requirements.

Key Features

  • Core Logic Capacity  Approximately 74,637 logic elements, enabling complex programmable logic implementations and aggregation of multiple functions on a single device.
  • Embedded Memory  Approximately 3.17 Mbits of on-chip RAM for temporary data storage, buffering, and state-machine memory needs.
  • I/O Count  280 user I/O pins to support wide parallel interfaces, multiple peripherals, and high-pin-count connectivity.
  • Power Domain  Core supply voltage range of 1.14 V to 1.26 V for the device core.
  • Package & Mounting  484-BBGA package (supplier package listed as 484-FBGA, 23×23) with surface-mount mounting for compact board-level integration.
  • Temperature & Grade  Commercial grade operation from 0 °C to 85 °C, suitable for standard commercial electronics environments.
  • Regulatory Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

  • Custom digital logic  Implement complex state machines and custom processing pipelines using the device's ~74,637 logic elements and embedded memory.
  • High-density I/O systems  Use the 280 I/O pins to interface with multiple sensors, buses, and peripherals in systems that require broad connectivity.
  • Memory-intensive buffering  Leverage the approximately 3.17 Mbits of on-chip RAM for buffering, FIFO implementation, and temporary data storage within streamed or packetized data designs.

Unique Advantages

  • Substantial programmable capacity: Nearly 75k logic elements let you consolidate functions that would otherwise require multiple discrete components, reducing BOM complexity.
  • On-chip memory for flexible data handling: Approximately 3.17 Mbits of embedded RAM supports data buffering and state retention without immediate reliance on external memory.
  • Large I/O footprint: 280 I/Os provide versatile connectivity options for parallel interfaces, multi-channel sensors, and mixed-signal front ends.
  • Compact surface-mount package: 484-BBGA (23×23) packaging enables high-density board layouts while maintaining a standardized form factor.
  • Commercial-grade operating range: Rated for 0 °C to 85 °C operation to match commercial electronics deployment scenarios.
  • RoHS compliant: Environmentally compliant manufacturing and material standards reduce supply-chain friction in many markets.

Why Choose XC6SLX75-L1FGG484C?

The XC6SLX75-L1FGG484C positions itself as a capable, mid-range Spartan®-6 LX FPGA option from AMD, balancing logic capacity, embedded memory, and extensive I/O in a compact 484-BBGA surface-mount package. Its electrical and thermal specifications support a wide range of commercial electronic designs that require on-device programmability and moderate on-chip storage.

This device is suitable for designers seeking to integrate multiple digital functions into a single programmable device while maintaining a compact board footprint and compliance with RoHS requirements. Its combination of logic density, memory, I/O, and commercial-grade operation delivers a practical platform for many embedded and system-level applications.

Request a quote or submit an inquiry to receive pricing and availability details for XC6SLX75-L1FGG484C and to discuss how this FPGA can fit your design requirements.

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