XC6SLX75-L1FGG484C
| Part Description |
Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 280 3170304 74637 484-BBGA |
|---|---|
| Quantity | 772 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 280 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5831 | Number of Logic Elements/Cells | 74637 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3170304 |
Overview of XC6SLX75-L1FGG484C – Spartan®-6 LX FPGA, 484-BBGA
The XC6SLX75-L1FGG484C is a Spartan®-6 LX field programmable gate array (FPGA) IC from AMD, supplied in a 484-BBGA package. It provides a mid-range, programmable logic platform with substantial logic capacity, embedded memory, and a large number of I/O pins for flexible system integration.
This device is surface-mount packaged and designed for commercial-grade applications, operating across a 0 °C to 85 °C range with a core supply voltage between 1.14 V and 1.26 V. Its combination of logic elements, embedded memory, and I/O count supports a broad set of digital design requirements.
Key Features
- Core Logic Capacity Approximately 74,637 logic elements, enabling complex programmable logic implementations and aggregation of multiple functions on a single device.
- Embedded Memory Approximately 3.17 Mbits of on-chip RAM for temporary data storage, buffering, and state-machine memory needs.
- I/O Count 280 user I/O pins to support wide parallel interfaces, multiple peripherals, and high-pin-count connectivity.
- Power Domain Core supply voltage range of 1.14 V to 1.26 V for the device core.
- Package & Mounting 484-BBGA package (supplier package listed as 484-FBGA, 23×23) with surface-mount mounting for compact board-level integration.
- Temperature & Grade Commercial grade operation from 0 °C to 85 °C, suitable for standard commercial electronics environments.
- Regulatory Compliance RoHS compliant to meet common environmental and manufacturing requirements.
Typical Applications
- Custom digital logic Implement complex state machines and custom processing pipelines using the device's ~74,637 logic elements and embedded memory.
- High-density I/O systems Use the 280 I/O pins to interface with multiple sensors, buses, and peripherals in systems that require broad connectivity.
- Memory-intensive buffering Leverage the approximately 3.17 Mbits of on-chip RAM for buffering, FIFO implementation, and temporary data storage within streamed or packetized data designs.
Unique Advantages
- Substantial programmable capacity: Nearly 75k logic elements let you consolidate functions that would otherwise require multiple discrete components, reducing BOM complexity.
- On-chip memory for flexible data handling: Approximately 3.17 Mbits of embedded RAM supports data buffering and state retention without immediate reliance on external memory.
- Large I/O footprint: 280 I/Os provide versatile connectivity options for parallel interfaces, multi-channel sensors, and mixed-signal front ends.
- Compact surface-mount package: 484-BBGA (23×23) packaging enables high-density board layouts while maintaining a standardized form factor.
- Commercial-grade operating range: Rated for 0 °C to 85 °C operation to match commercial electronics deployment scenarios.
- RoHS compliant: Environmentally compliant manufacturing and material standards reduce supply-chain friction in many markets.
Why Choose XC6SLX75-L1FGG484C?
The XC6SLX75-L1FGG484C positions itself as a capable, mid-range Spartan®-6 LX FPGA option from AMD, balancing logic capacity, embedded memory, and extensive I/O in a compact 484-BBGA surface-mount package. Its electrical and thermal specifications support a wide range of commercial electronic designs that require on-device programmability and moderate on-chip storage.
This device is suitable for designers seeking to integrate multiple digital functions into a single programmable device while maintaining a compact board footprint and compliance with RoHS requirements. Its combination of logic density, memory, I/O, and commercial-grade operation delivers a practical platform for many embedded and system-level applications.
Request a quote or submit an inquiry to receive pricing and availability details for XC6SLX75-L1FGG484C and to discuss how this FPGA can fit your design requirements.

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