XC6SLX75-N3FG484I

The XC6SLX75-N3FG484I is a Spartan®-6 LX Field Programmable Gate Array (FPGA) IC by AMD, supplied in a 484-ball BGA package. It provides a combination of on-chip logic and embedded memory suitable for industrial-grade designs that require a balance of I/O count, logic capacity, and on-chip RAM.

Targeted for applications that demand configurable hardware resources within an industrial temperature range, this device supports designs that need substantial logic resources, moderate embedded memory, and a large number of I/O signals in a surface-mount package.

Key Features

• Logic Capacity — 74,637 logic elements to implement complex digital designs and custom logic functions.
• Embedded Memory — Approximately 3.17 Mbits of on-chip RAM for buffering, lookup tables, and temporary storage.
• I/O — 280 user I/O pins to interface with sensors, peripherals, and external devices.
• Power Supply — Core voltage range from 1.14 V to 1.26 V to match system power architectures.
• Package and Mounting — 484-ball BGA package (supplier device package listed as 484-FBGA 23×23) designed for surface-mount assembly.
• Operating Range — Industrial temperature rating from −40 °C to 100 °C for deployment in challenging environments.
• Compliance — RoHS compliant, supporting regulatory requirements for lead-free manufacturing.

Typical Applications

• Industrial control — Use the device’s industrial temperature rating and 280 I/O to interface with sensors, actuators, and control buses in factory automation and PLC systems.
• Embedded systems — Deploy the FPGA’s 74,637 logic elements and approximately 3.17 Mbits of on-chip RAM for custom processing, glue logic, and peripheral aggregation in embedded products.
• Communications and networking — Leverage the ample I/O and logic resources for protocol bridging, packet processing, and interface management in networking equipment.

Unique Advantages

• Substantial logic density: 74,637 logic elements provide capacity for multi-function designs without requiring external programmable logic.
• Moderate on-chip RAM: Approximately 3.17 Mbits of embedded memory reduces dependence on external memory for many buffering and LUT needs.
• High I/O count: 280 I/O pins enable broad connectivity to peripherals, sensors, and external interfaces directly from the FPGA.
• Industrial-grade operation: Rated for −40 °C to 100 °C, making the device suitable for deployment in temperature-demanding environments.
• Compact surface-mount packaging: 484-BBGA / 484-FBGA (23×23) package supports high-density board layouts and automated assembly processes.
• Regulatory readiness: RoHS compliance facilitates integration into lead-free manufacturing flows.

Why Choose XC6SLX75-N3FG484I?

The XC6SLX75-N3FG484I delivers a balanced mix of logic resources, embedded memory, and I/O capability in an industrial-grade Spartan®-6 LX FPGA form factor. Its combination of 74,637 logic elements, approximately 3.17 Mbits of on-chip RAM, and 280 I/O make it well suited for engineers designing industrial control systems, embedded platforms, and communication interfaces that require configurable hardware resources.

Manufactured by AMD and offered in a compact 484-ball BGA surface-mount package with RoHS compliance, this device is positioned for designs that need reliable operation across a wide temperature range and a strong set of programmable hardware resources.

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