XC6SLX75T-2CSG484C

IC FPGA 292 I/O 484CSBGA
Part Description

Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 292 3170304 74637 484-FBGA, CSPBGA

Quantity 1,160 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-CSPBGA (19x19)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-FBGA, CSPBGANumber of I/O292Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5831Number of Logic Elements/Cells74637
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3170304

Overview of XC6SLX75T-2CSG484C – Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 292 3170304 74637 484-FBGA, CSPBGA

The XC6SLX75T-2CSG484C is a Spartan®-6 LXT field programmable gate array (FPGA) IC from AMD supplied in a 484-CSPBGA package. It delivers substantial programmable logic capacity, on-chip memory and a high I/O count in a surface-mount FBGA footprint.

Key device parameters include approximately 74,637 logic elements, approximately 3.17 Mbits of embedded memory, 292 I/O, a nominal core supply range of 1.14–1.26 V, commercial-grade operation from 0°C to 85°C, and RoHS compliance.

Key Features

  • Core Logic  Approximately 74,637 logic elements provide programmable resources for implementing custom digital functions and complex state machines.
  • Embedded Memory  Approximately 3.17 Mbits of on-chip RAM to support buffering, FIFOs and local data storage within the FPGA fabric.
  • I/O Capacity  292 I/O pins deliver broad external connectivity for interfaces, sensors and peripherals.
  • Power  Operates with a supply window of 1.14–1.26 V, suitable for designs targeting this core voltage range.
  • Package & Mounting  484-CSPBGA (19×19) package in a 484-FBGA format configured for surface-mount assembly.
  • Temperature & Grade  Commercial-grade device rated for 0°C to 85°C operation.
  • Environmental Compliance  RoHS compliant for regulatory and manufacturing considerations.

Unique Advantages

  • High logic density: The large number of logic elements enables consolidation of multiple functions into a single FPGA, reducing BOM count.
  • Substantial on-chip memory: Approximately 3.17 Mbits of embedded RAM supports local data storage, buffering and packet handling without external memory.
  • Extensive I/O: 292 I/O pins provide flexibility for routing diverse external interfaces and expanding system connectivity.
  • Compact FBGA package: The 484-CSPBGA (19×19) footprint balances device density with a surface-mount assembly suitable for compact PCBs.
  • Controlled supply range: Operation across 1.14–1.26 V supports designs targeting this core voltage region and simplifies power management choices.
  • Commercial-grade and compliant: Rated for 0°C to 85°C and RoHS compliant to meet common commercial product requirements.

Why Choose XC6SLX75T-2CSG484C?

The XC6SLX75T-2CSG484C positions itself as a mid-to-high-density Spartan®-6 LXT FPGA option that combines a large programmable fabric, meaningful embedded memory and a high I/O count in a 484-CSPBGA surface-mount package. Its specification set matches applications that require substantial on-chip logic and memory within a commercial temperature range and a compact board footprint.

Backed by AMD's Spartan®-6 LXT family, this device is suited to teams and designs that need scalable programmable resources, strong I/O capability and RoHS compliance while operating within a 1.14–1.26 V supply domain.

Request a quote or submit an inquiry today to obtain pricing and availability for the XC6SLX75T-2CSG484C.

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