XC6SLX75T-2FGG484C

The XC6SLX75T-2FGG484C is a Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC provided in a 484-BBGA package. It integrates 74,637 logic elements, approximately 3.17 Mbits of embedded memory, and 268 user I/O pins, making it suitable for designs that require on-chip logic density combined with substantial I/O capability.

Designed for surface-mount assembly, the device operates over a supply range of 1.14 V to 1.26 V and is specified for commercial temperature operation from 0 °C to 85 °C. The part is RoHS compliant.

Key Features

• Core Logic  74,637 logic elements provide the programmable fabric for implementing custom digital functions and system logic.
• Embedded Memory  Approximately 3.17 Mbits of on-chip RAM for buffering, microcode, and state storage.
• I/O Capacity  268 user I/O pins enable interfacing to multiple peripherals and external devices.
• Package  484-BBGA package (supplier device package: 484-FBGA, 23×23) supports compact board-level integration with surface-mount mounting.
• Power  Supply voltage range from 1.14 V to 1.26 V to match targeted FPGA core power requirements.
• Operating Temperature  Commercial temperature grade specified from 0 °C to 85 °C for typical commercial applications.
• Compliance  RoHS compliant for regulatory and environmental considerations.

Typical Applications

• Prototyping and Development  Implements custom digital logic and system prototypes where on-chip logic and memory are required.
• I/O-Intensive Interfaces  Supports designs that need a high count of user I/O pins for connecting multiple sensors, peripherals, or external modules.
• Embedded Logic Functions  Provides programmable resources and embedded RAM for state machines, data buffering, and control functions.

Unique Advantages

• Substantial Logic Capacity: 74,637 logic elements allow implementation of sizable custom logic and parallel processing blocks on-chip.
• Significant On-Chip Memory: Approximately 3.17 Mbits of embedded RAM reduce reliance on external memory for many designs.
• High I/O Count: 268 user I/O pins enable flexible interfacing and reduce the need for external I/O expanders.
• Compact Ball Grid Package: 484-BBGA / 484-FBGA (23×23) package supports space-efficient board layouts and surface-mount assembly.
• Commercial Temperature Rating: Specified 0 °C to 85 °C operation aligns with standard commercial electronics requirements.
• RoHS Compliant: Meets lead-free and restricted substances requirements for compliant product designs.

Why Choose XC6SLX75T-2FGG484C?

The XC6SLX75T-2FGG484C combines a large logic fabric, substantial embedded memory, and a high I/O count in a compact 484-ball BGA package, making it an option for commercial designs that need on-chip integration of custom digital functions. Its supply voltage range and commercial temperature rating provide straightforward integration into standard commercial systems.

For engineering teams seeking a programmable solution with significant on-chip resources, this Spartan®-6 LXT device offers verifiable specifications for logic capacity, memory, I/O, and packaging to support system-level consolidation and predictable board-level integration.

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