XC6SLX75T-2FGG676I

The XC6SLX75T-2FGG676I is a Spartan®-6 LXT field programmable gate array (FPGA) IC designed for industrial applications. It provides programmable logic together with a substantial complement of I/O and embedded memory in a compact 676-FBGA (27×27) surface-mount package.

With 74,637 logic elements, approximately 3.17 Mbits of on-chip RAM, and 348 user I/O pins, this device targets designs that require significant logic density, on-chip memory, and flexible I/O while operating across a broad industrial temperature range.

Key Features

• Logic Capacity — 74,637 logic elements provide substantial programmable logic resources for complex digital designs.
• Embedded Memory — Total on-chip RAM of 3,170,304 bits (approximately 3.17 Mbits) for data buffering, packet processing, and state storage.
• I/O Resources — 348 user I/O pins enable a wide range of parallel interfaces and signal connectivity options.
• Package and Mounting — 676-BGA package (supplier device package: 676-FBGA, 27×27) optimized for surface-mount PCB assembly and compact board layouts.
• Power Supply — Nominal core supply range from 1.14 V to 1.26 V to match specified device requirements.
• Industrial Temperature Grade — Rated for operation from −40 °C to 100 °C for use in demanding environments.
• Standards Compliance — RoHS compliant.

Unique Advantages

• High logic density: 74,637 logic elements enable implementation of complex digital functions on a single device, reducing system complexity.
• Significant on-chip memory: Approximately 3.17 Mbits of embedded RAM supports buffering, lookup tables, and intermediate storage without external memory.
• Extensive I/O count: 348 I/O pins provide flexibility for multiple parallel interfaces and external connectivity, simplifying board-level routing.
• Industrial temperature range: Specified operation from −40 °C to 100 °C supports deployment in temperature-challenging environments.
• Compact surface-mount package: 676-FBGA (27×27) offers a high pin-count footprint in a compact form factor for dense PCB designs.
• Controlled core voltage window: 1.14–1.26 V supply range enables predictable power design and compatibility with regulated power rails.

Why Choose XC6SLX75T-2FGG676I?

The XC6SLX75T-2FGG676I positions itself as a robust, industrial-grade FPGA option that balances logic capacity, embedded memory, and I/O density in a compact 676-FBGA package. Its specification set—74,637 logic elements, roughly 3.17 Mbits of on-chip RAM, 348 I/O pins, and operation across −40 °C to 100 °C—makes it suitable for designs that require on-board programmability and reliable operation in industrial conditions.

This device is appropriate for engineers and procurement teams seeking a scalable, high-density programmable logic device with clear electrical and thermal parameters. Its RoHS compliance and surface-mount packaging support modern manufacturing and regulatory requirements while simplifying system integration.

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