XC6SLX75T-3FG676I
| Part Description |
Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 348 3170304 74637 676-BGA |
|---|---|
| Quantity | 306 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 348 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 5831 | Number of Logic Elements/Cells | 74637 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3170304 |
Overview of XC6SLX75T-3FG676I – Spartan®-6 LXT FPGA, 676‑BGA, Industrial
The XC6SLX75T-3FG676I is a Spartan®-6 LXT field-programmable gate array (FPGA) supplied in a 676‑BGA package for surface-mount applications. It provides a substantial on-chip logic and memory resource set along with a large number of user I/O and an industrial operating temperature range, making it suitable for robust embedded designs.
Key Features
- Core Logic Capacity Contains 74,637 logic elements for implementing user-defined digital logic and state machines.
- Embedded Memory Approximately 3.17 Mbits of embedded memory (3,170,304 total RAM bits) for buffering, lookup tables, and on-chip storage.
- I/O Density Provides 348 user I/Os to interface with external peripherals and system buses.
- Power Supply Operates from a supply voltage range of 1.14 V to 1.26 V.
- Package & Mounting 676‑FBGA (27×27 mm) package in a 676‑BGA footprint, designed for surface-mount assembly.
- Industrial Temperature Range Rated for operation from −40 °C to 100 °C for use in demanding environments.
- Compliance RoHS compliant.
Unique Advantages
- High logic density: 74,637 logic elements give designers ample resources for complex FPGA implementations without external logic.
- Significant on‑chip memory: Approximately 3.17 Mbits of embedded memory supports local buffering and state storage to reduce external memory dependence.
- Broad I/O capability: 348 I/Os enable flexible interfacing options and support for multiple peripherals and bus standards.
- Industrial suitability: The −40 °C to 100 °C rating supports deployment in industrial and temperature-demanding applications.
- Compact, surface‑mount package: The 676‑FBGA (27×27) package provides a dense, manufacturable solution for space-constrained PCBs.
- Regulatory compliance: RoHS compliance supports environmentally conscious product design and supply-chain requirements.
Why Choose XC6SLX75T-3FG676I?
The XC6SLX75T-3FG676I combines a large logic element count, substantial embedded memory, and a high I/O count within a compact 676‑BGA package, all rated for industrial temperature operation. These characteristics make it well suited for embedded systems that require on-chip logic density, local memory resources, and flexible interfacing while maintaining manufacturability with surface-mount assembly.
This part is a practical choice for engineers and procurement teams seeking a field-programmable solution that balances logic capacity, memory, and I/O in an industrial-grade package with RoHS compliance.
Request a quote or submit an inquiry to receive pricing and availability information for the XC6SLX75T-3FG676I.
Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH
