XC6SLX75T-3FGG676C

The XC6SLX75T-3FGG676C is a Spartan®-6 LXT field programmable gate array (FPGA) delivered in a 676-ball BGA package for surface-mount applications. It provides a programmable fabric with substantial logic capacity, embedded RAM, and a high I/O count for complex digital designs.

Key device attributes include approximately 74,637 logic elements, approximately 3.17 Mbits of on-chip RAM, 348 I/O pins, a 676-FBGA (27×27) package, a core supply range of 1.14 V to 1.26 V, and a commercial operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core logic capacity  Approximately 74,637 logic elements provide a large programmable fabric for implementing custom digital functions.
• Embedded memory  Approximately 3.17 Mbits of on-chip RAM to support buffering, state storage, and local memory requirements within designs.
• High I/O density  348 general-purpose I/O pins allow connection to multiple peripherals, buses, sensors, and external devices.
• Package and mounting  676-FBGA (27×27) package in a 676-BGA footprint enables compact, surface-mount system integration.
• Power supply  Core voltage supply range of 1.14 V to 1.26 V for device operation.
• Operating temperature and grade  Commercial temperature range of 0 °C to 85 °C; product is specified as Commercial grade.
• Regulatory status  RoHS compliant.

Typical Applications

• Custom digital logic and prototyping  Implement complex state machines, signal processing blocks, and bespoke logic where significant programmable resources and on-chip RAM are required.
• I/O-rich embedded systems  Connect multiple peripherals and interfaces using the device’s 348 I/Os to centralize control and data routing in a single FPGA.
• Compact surface-mount designs  The 676-FBGA (27×27) package supports high-density, space-constrained PCBs that require a surface-mount FPGA solution.

Unique Advantages

• High logic density: Approximately 74,637 logic elements enable integration of sizeable logic functions without external ASICs or additional PLDs.
• Substantial on-chip memory: Approximately 3.17 Mbits of embedded RAM reduce dependence on external memory for many buffering and caching tasks.
• Extensive connectivity: 348 I/O pins support multi-device interfacing and flexible system partitioning.
• Compact BGA package: 676-FBGA (27×27) provides a space-efficient footprint for compact hardware designs.
• Low-voltage core operation: Narrow core supply range (1.14 V–1.26 V) supports predictable power planning in system design.
• RoHS compliant and commercial grade: Meets RoHS requirements and is specified for 0 °C to 85 °C operation for commercial applications.

Why Choose XC6SLX75T-3FGG676C?

The XC6SLX75T-3FGG676C combines a high count of programmable logic elements, meaningful on-chip RAM, and a large I/O complement in a compact 676-FBGA package—making it suitable for designs that require consolidated programmable logic, local memory, and rich connectivity. Its commercial temperature rating and RoHS compliance support mainstream embedded and electronics applications.

This device is well suited for engineering teams and procurement seeking a surface-mount FPGA solution with clear, verifiable specifications for logic capacity, memory, I/O, power, and package dimensions.

Request a quote or submit an inquiry to obtain pricing and availability for the XC6SLX75T-3FGG676C. Include quantity and delivery requirements to receive a tailored response.