XC6SLX9-2CSG225C
| Part Description |
Spartan®-6 LX Field Programmable Gate Array (FPGA) IC 160 589824 9152 225-LFBGA, CSPBGA |
|---|---|
| Quantity | 922 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 225-CSPBGA (13x13) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 225-LFBGA, CSPBGA | Number of I/O | 160 | Voltage | 1.14 V - 1.26 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 715 | Number of Logic Elements/Cells | 9152 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 589824 |
Overview of XC6SLX9-2CSG225C – Spartan®-6 LX FPGA, 9,152 Logic Elements, 225‑LFBGA
The XC6SLX9-2CSG225C is a Spartan®-6 LX field programmable gate array (FPGA) from AMD designed for commercial applications. It combines significant on-chip memory and I/O capability with a mid-range logic capacity to support embedded logic, interface, and control functions.
With 9,152 logic elements, approximately 0.59 Mbits of embedded RAM and 160 user I/O pins in a compact 225‑LFBGA (13×13) package, this device targets applications that require flexible, reprogrammable logic with on-chip memory and substantial I/O integration.
Key Features
- Logic Capacity Offers 9,152 logic elements suitable for mid-range programmable logic implementations and custom digital functions.
- On‑Chip Memory Includes approximately 0.59 Mbits (589,824 bits) of embedded RAM for data buffering, lookup tables, and state storage.
- I/O Resources Provides 160 user I/O pins to support a variety of external interfaces and parallel connections.
- Supply Voltage Operates with a core voltage range of 1.14 V to 1.26 V, enabling predictable power requirements for system power budgeting.
- Package & Mounting Supplied in a 225‑LFBGA (225‑CSPBGA, 13×13) package with surface-mount mounting for compact PCB designs.
- Operating Range Rated for commercial temperature operation from 0 °C to 85 °C.
- RoHS Compliant Manufactured to meet RoHS environmental requirements.
Typical Applications
- Embedded Systems Implement custom control logic and data handling where moderate logic density and on-chip RAM reduce external components.
- Interface Bridging Provide flexible I/O buffering and protocol bridging using 160 available user I/Os to connect multiple peripherals or buses.
- Consumer Electronics Enable reprogrammable feature sets and real-time control in commercial-grade consumer devices within the specified temperature range.
- Prototyping & Development Serve as a development platform for evaluating mid-range FPGA designs that require embedded memory and sizable I/O count.
Unique Advantages
- Balanced Logic and Memory Combines 9,152 logic elements with approximately 0.59 Mbits of on-chip RAM to support integrated logic and data storage without excessive external memory.
- High I/O Count 160 user I/Os simplify board-level integration and reduce the need for multiple interface ICs.
- Compact Package 225‑LFBGA (13×13) CSPBGA package provides a space-efficient footprint for dense PCB layouts.
- Predictable Power Envelope Defined core voltage range (1.14 V–1.26 V) assists in power supply design and system power planning.
- Commercial Temperature Rating Rated 0 °C to 85 °C for reliable operation in commercial environments.
- RoHS Compliance Meets environmental handling requirements for lead-free assembly processes.
Why Choose XC6SLX9-2CSG225C?
The XC6SLX9-2CSG225C positions itself as a commercially rated Spartan‑6 LX FPGA that delivers a balanced combination of logic element count, embedded RAM, and I/O capacity in a compact 225‑LFBGA package. It is well suited for engineers and designers implementing mid-range programmable logic, interface bridging, and embedded control solutions where on-chip memory and a high I/O count simplify system design.
Backed by AMD manufacturing and provided with clear electrical and thermal ratings, this device offers predictable integration into commercial products and development platforms that require reprogrammable logic with moderate resource requirements.
Request a quote or submit a pricing inquiry to receive availability and lead-time information for the XC6SLX9-2CSG225C.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








