XC6SLX9-2CSG324C

The XC6SLX9-2CSG324C is a Spartan®-6 LX field programmable gate array (FPGA) offered in a 324-pin CSPBGA package. It provides 9,152 logic elements, approximately 0.59 Mbits of embedded RAM, and 200 I/O pins in a surface-mount 324-LFBGA (324-CSPBGA, 15×15) footprint.

Designed for commercial-grade applications, this device operates from a 1.14 V to 1.26 V core supply and is rated for 0 °C to 85 °C operation. It is RoHS compliant and intended for designs that require a combination of logic capacity, on-chip memory, and a compact package.

Key Features

• Core Logic — 9,152 logic elements (cells) provide programmable logic resources for custom digital functions.
• Embedded Memory — Approximately 589,824 bits of on-chip RAM support data buffering, state storage, and small memory structures without external RAM.
• I/O Capacity — 200 available I/O pins accommodate multiple interfaces and external peripherals.
• Power — Core voltage supply range of 1.14 V to 1.26 V for predictable power planning.
• Package & Mounting — 324-LFBGA (324-CSPBGA, 15×15) surface-mount package for compact board-level integration.
• Grade & Environment — Commercial grade with an operating temperature range of 0 °C to 85 °C; RoHS compliant.

Unique Advantages

• Compact package footprint: The 324-CSPBGA (15×15) package delivers a high pin count in a small board area, enabling denser PCB layouts.
• Balanced logic and memory: The combination of 9,152 logic elements and approximately 0.59 Mbits of embedded RAM supports designs that need both programmable logic and on-chip storage.
• Ample I/O: With 200 I/O pins, the device supports multiple external interfaces and peripheral connections without immediate need for expansion.
• Predictable power planning: A defined core voltage range (1.14 V–1.26 V) simplifies power-supply design for the FPGA core.
• Commercial-grade readiness: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial deployments.

Why Choose XC6SLX9-2CSG324C?

The XC6SLX9-2CSG324C offers a practical mix of programmable logic, embedded memory, and I/O density in a compact 324-LFBGA surface-mount package. Its specification set—9,152 logic elements, approximately 0.59 Mbits of on-chip RAM, 200 I/Os, and a narrow core voltage range—makes it suitable for commercial designs that require integrated logic and memory resources without large board area demands.

This device is appropriate for engineers and procurement teams specifying FPGAs for commercial-temperature applications who need a RoHS-compliant, surface-mount FPGA with defined electrical and thermal limits.

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