XC6SLX9-3CSG225I

The XC6SLX9-3CSG225I is a Spartan®-6 LX field-programmable gate array (FPGA) in a 225-pin CSPBGA package, manufactured by AMD. It provides mid-range programmable logic capacity with on-chip memory and a substantial I/O complement in a compact surface-mount package suitable for industrial temperature environments.

Key Features

• Logic Resources — 9,152 logic elements organized across 715 configurable logic block units (CLBs) to implement custom digital functions and control logic.
• Embedded Memory — Approximately 0.59 Mbits of on-chip RAM for data buffering, FIFOs, and small lookup tables.
• I/O Capacity — 160 user I/O pins to support multiple parallel interfaces and peripheral connections.
• Power Supply — Core voltage range of 1.14 V to 1.26 V, enabling defined power sequencing and supply planning.
• Package & Mounting — 225-CSPBGA (13×13) / 225-LFBGA package; surface-mount device footprint for compact PCB designs.
• Industrial Temperature Rating — Operating range from -40 °C to 100 °C for deployment in temperature-challenging environments.
• Regulatory Compliance — RoHS-compliant material and manufacturing status.

Unique Advantages

• Balanced Logic and Memory: 9,152 logic elements combined with approximately 0.59 Mbits of embedded RAM supports a wide set of mid-range digital functions without external SRAM for many designs.
• High I/O Count: 160 I/O pins enable interfacing to multiple peripherals, sensors, and buses, reducing external glue logic.
• Compact, Surface-Mount Packaging: The 225-CSPBGA (13×13) package delivers a small PCB footprint while preserving routing density for complex connectors.
• Industrial Temperature Capability: Rated for -40 °C to 100 °C operation to meet environmental robustness requirements in industrial deployments.
• Predictable Power Envelope: Narrow core voltage range (1.14 V–1.26 V) simplifies power supply design and sequencing considerations.
• Regulatory Alignment: RoHS compliance supports environmental and material requirements for commercial and industrial product builds.

Why Choose XC6SLX9-3CSG225I?

The XC6SLX9-3CSG225I is positioned for designs that require a mid-range FPGA with a compact package, substantial I/O, and embedded memory while meeting industrial temperature requirements. Its combination of 9,152 logic elements, approximately 0.59 Mbits of on-chip RAM, and 160 I/O pins makes it suitable for applications that need programmable logic density and flexible interfacing without a large board footprint.

Manufactured by AMD and delivered in a 225-CSPBGA surface-mount package, this part offers a practical balance of integration, thermal range, and material compliance for professional embedded and industrial designs where predictable electrical and environmental specifications are required.

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