XC6SLX45T-3FGG484I

The XC6SLX45T-3FGG484I is an industrial-grade Spartan®-6 LXT FPGA from AMD, delivered in a 484-BBGA (484-FBGA, 23×23) surface-mount package. It combines substantial logic capacity with on-chip memory and ample I/O to support a range of embedded and industrial applications.

Key on-chip resources include 43,661 logic elements, approximately 2.14 Mbits of embedded memory, and 296 user I/O pins, operating from a core supply of 1.14 V to 1.26 V and rated for -40°C to 100°C.

Key Features

• Core Logic — Provides 43,661 logic elements to implement custom digital logic, state machines, and datapath functions.
• Embedded Memory — Approximately 2.14 Mbits of on-chip RAM for buffering, FIFOs, and small data stores directly inside the FPGA fabric.
• I/O Capacity — 296 available I/O pins to support a broad set of external interfaces and parallel connectivity needs.
• Package & Mounting — Delivered in a 484-BBGA (supplier package described as 484-FBGA, 23×23) surface-mount package for compact board-level integration.
• Power — Core voltage supply range of 1.14 V to 1.26 V to match system power requirements.
• Industrial Temperature Grade — Rated for operation from -40°C to 100°C, suitable for industrial environments.
• Compliance — RoHS compliant to support regulatory requirements for lead-free manufacturing.

Typical Applications

• Industrial Control — Implement motor control logic, protocol bridging, or custom I/O handling where industrial temperature range and robust I/O count are needed.
• Communications Equipment — Perform packet buffering, protocol adaptation, and interface aggregation using the on-chip RAM and extensive I/O.
• Embedded Processing — Offload deterministic hardware tasks and custom accelerators into FPGA fabric leveraging the device’s logic density and embedded memory.

Unique Advantages

• High Logic Density: 43,661 logic elements provide capacity for complex logic implementations without external ASIC development.
• On-Chip Memory: Approximately 2.14 Mbits of embedded RAM reduces dependence on external memory for buffering and small data structures.
• Extensive I/O: 296 I/O pins allow flexible interfacing to sensors, peripherals, and parallel buses directly from the FPGA.
• Industrial Temperature Range: Rated from -40°C to 100°C to meet the environmental needs of factory and field-deployed systems.
• Compact Package: 484-BBGA (23×23) surface-mount package enables high-density board layouts while maintaining a large resource set.
• Regulatory Compliance: RoHS compliance supports lead-free manufacturing requirements.

Why Choose XC6SLX45T-3FGG484I?

The XC6SLX45T-3FGG484I positions itself as an industrial-grade FPGA option that balances significant logic capacity, embedded memory, and a large I/O complement in a compact 484-BBGA package. Its specified core voltage range and wide operating temperature make it suitable for embedded systems that must operate reliably in demanding environments.

This device is suited for engineering teams and procurement looking for a mid-density FPGA solution that supports custom logic, buffering, and interface tasks while meeting industrial temperature and RoHS requirements.

Request a quote today to receive pricing and availability information for the XC6SLX45T-3FGG484I and to discuss how it can fit your next embedded or industrial design.