XC6SLX45T-3CSG324I

IC FPGA 190 I/O 324CSBGA
Part Description

Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 190 2138112 43661 324-LFBGA, CSPBGA

Quantity 1,020 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSPBGA (15x15)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case324-LFBGA, CSPBGANumber of I/O190Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3411Number of Logic Elements/Cells43661
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits2138112

Overview of XC6SLX45T-3CSG324I – Spartan®-6 LXT FPGA, 324‑LFBGA (Industrial)

The XC6SLX45T-3CSG324I is a Spartan‑6 LXT Field Programmable Gate Array (FPGA) IC from AMD, delivered in a 324‑pin CSPBGA/LFBGA package. It provides reconfigurable logic with substantial on‑chip memory, a high I/O count and a compact surface‑mount package for embedded and industrial applications requiring flexible digital integration.

Key Features

  • Logic Capacity — Contains 43,661 logic elements, enabling moderate to complex programmable logic implementations.
  • Embedded Memory — Approximately 2.14 Mbits of on‑chip RAM (2,138,112 total RAM bits) for data buffering, FIFOs and local storage without external memory.
  • I/O Resources — 190 available I/O pins to support multiple peripherals, interfaces and board-level connections.
  • Power Supply — Operates from a core voltage range of 1.14 V to 1.26 V to match modern low‑voltage power rails.
  • Package & Mounting — Supplied in a 324‑CSPBGA (15 × 15) / 324‑LFBGA surface‑mount package for compact PCB integration.
  • Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
  • Regulatory Compliance — RoHS compliant for environmentally conscious designs.

Unique Advantages

  • Substantial on‑chip integration: 43,661 logic elements and approximately 2.14 Mbits of embedded memory reduce reliance on external logic and RAM components.
  • High I/O density: 190 I/O pins facilitate multi‑channel interfacing and board-level consolidation, simplifying system routing and connector requirements.
  • Compact surface‑mount package: The 324‑CSPBGA (15×15) package enables small form‑factor PCB designs while maintaining thermal and electrical performance.
  • Industrial temperature rating: −40 °C to 100 °C operating range supports reliable operation across a wide set of environmental conditions.
  • Low‑voltage core operation: 1.14 V to 1.26 V supply compatibility aids integration with contemporary power architectures and helps optimize power budgets.
  • RoHS compliant: Meets environmental regulatory expectations for modern electronics manufacturing.

Why Choose XC6SLX45T-3CSG324I?

The XC6SLX45T-3CSG324I combines a high logic element count, significant on‑chip memory and a dense I/O complement in a compact 324‑pin CSPBGA/LFBGA surface‑mount package. Its industrial temperature rating and low core voltage range make it well suited for designs that need reliable, reconfigurable logic with on‑chip storage and flexible interfacing options.

As an AMD Spartan‑6 LXT device, this FPGA is positioned for engineers and procurement teams seeking a balance of integration, scalability and environmental compliance for medium‑complexity programmable‑logic tasks.

Request a quote or submit a purchase inquiry today to learn about availability and pricing for the XC6SLX45T-3CSG324I.

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