XC6SLX45T-2FG484I

IC FPGA 296 I/O 484FBGA
Part Description

Spartan®-6 LXT Field Programmable Gate Array (FPGA) IC 296 2138112 43661 484-BBGA

Quantity 328 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time12 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O296Voltage1.14 V - 1.26 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs3411Number of Logic Elements/Cells43661
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2138112

Overview of XC6SLX45T-2FG484I – Spartan®-6 LXT FPGA, 484‑BBGA, Industrial

The XC6SLX45T-2FG484I is an AMD Spartan®-6 LXT Field Programmable Gate Array supplied in a 484‑BBGA surface-mount package. It provides 43,661 logic elements, approximately 2.14 Mbits of embedded memory, and 296 user I/Os, making it suitable for designs that require a mid-range FPGA resource set within an industrial temperature envelope.

Device electrical and mechanical characteristics include a supply voltage range of 1.14 V to 1.26 V and a supplier device package of 484‑FBGA (23×23). The device is RoHS compliant.

Key Features

  • Logic Capacity  Provides 43,661 logic elements to implement custom digital logic and state machines.
  • Embedded Memory  Approximately 2.14 Mbits of on-chip RAM for frame buffers, FIFOs, and small data structures.
  • I/O Count  296 user I/O pins to support multiple parallel interfaces and signal banks.
  • Power Supply  Operates from a supply range of 1.14 V to 1.26 V, supporting controlled core power domains.
  • Package & Mounting  Surface-mount 484‑BBGA package; supplier device package specified as 484‑FBGA (23×23) for compact board integration.
  • Temperature & Grade  Industrial-grade device rated for operation from −40 °C to 100 °C for demanding environments.
  • Environmental Compliance  RoHS compliant for regulatory and manufacturing alignment.

Typical Applications

  • Industrial control  I/O-dense systems that benefit from industrial temperature range and flexible, reprogrammable logic resources.
  • Embedded digital processing  Designs that require tens of thousands of logic elements and on-chip RAM for custom data paths or protocol handling.
  • Prototyping and system integration  Hardware development and evaluation where a surface-mount FBGA package and mid-range FPGA capacity are required.

Unique Advantages

  • Balanced logic and memory: Offers a combination of ~43,661 logic elements and ~2.14 Mbits of embedded memory for mixed logic and buffering tasks.
  • High I/O availability: With 296 I/Os, the device supports extensive external interfacing without external I/O expanders.
  • Industrial temperature rating: Rated −40 °C to 100 °C to meet requirements for temperature-sensitive deployments.
  • Compact FBGA form factor: 484‑FBGA (23×23) package enables dense PCB integration while maintaining a large FPGA resource set.
  • Regulatory alignment: RoHS compliance simplifies environmental and manufacturing considerations.

Why Choose XC6SLX45T-2FG484I?

The XC6SLX45T-2FG484I positions itself as a mid-range Spartan®-6 LXT FPGA that delivers a substantial logic element count, meaningful embedded memory, and a high I/O count in a compact surface-mount FBGA package. Its industrial temperature rating and RoHS compliance make it a pragmatic choice for designs that require reprogrammable logic in challenging environments.

This device suits development teams and procurement groups seeking a reconfigurable solution with defined electrical and mechanical characteristics—offering predictable integration into embedded systems that need moderate FPGA resources and robust operating temperature tolerance.

Request a quote or submit a procurement inquiry to check availability, pricing, and lead times for the XC6SLX45T-2FG484I.

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