XC7A100T-1FG676I

The XC7A100T-1FG676I is an industrial-grade Artix-7 Field Programmable Gate Array (FPGA) from AMD. It delivers a high logic capacity of 101,440 logic elements and approximately 4.98 Mbits of embedded memory in a compact 676-BGA package.

Designed for surface-mount applications, this device provides 300 user I/O, an optimized core voltage range, and an extended operating temperature range suitable for industrial environments.

Key Features

• Logic Capacity  101,440 logic elements for implementing complex programmable logic and custom digital functions.
• Embedded Memory  Approximately 4.98 Mbits of on-chip RAM to support buffering, lookup tables, and state storage.
• I/O  300 user I/O pins to support multiple external interfaces and parallel connections.
• Power  Core voltage supply range of 0.95 V to 1.05 V, enabling stable operation within specified supply limits.
• Package & Mounting  676-BGA package (supplier package: 676-FBGA, 27×27 mm) with surface-mount mounting for dense board integration.
• Temperature & Grade  Industrial grade with an operating temperature range of −40°C to 100°C for reliable operation in demanding environments.
• Compliance  RoHS compliant to meet lead-free environmental requirements.
• Manufacturer  Produced by AMD.

Unique Advantages

• High logic density: 101,440 logic elements enable implementation of sizable digital designs without external logic expansion.
• Substantial on-chip memory: Approximately 4.98 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-path tasks.
• Generous I/O count: 300 user I/O pins provide flexibility for multi-channel interfaces and parallel connectivity options.
• Industrial temperature capability: Rated from −40°C to 100°C to support deployment in temperature-challenging environments.
• Compact, high-density package: 676-BGA (676-FBGA, 27×27) and surface-mount form factor streamline board-level integration where space is constrained.
• Controlled core voltage range: 0.95–1.05 V supply window supports predictable power planning and design margins.

Why Choose XC7A100T-1FG676I?

The XC7A100T-1FG676I combines a high logic element count, significant embedded memory, and a large I/O complement within an industrial-temperature, RoHS-compliant package. These characteristics make it well suited to designs that require substantial on-chip resources while maintaining a compact board footprint.

This device is appropriate for design teams and procurement seeking an industrial-grade Artix-7 FPGA with predictable power and thermal operating ranges, a high-density BGA package, and the on-chip capacity to consolidate multiple functions into a single programmable device.

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