XC7A100T-1FGG676C

The XC7A100T-1FGG676C is an Artix-7 Field Programmable Gate Array (FPGA) from AMD, supplied in a 676-ball BGA package. It provides a high-density programmable logic fabric with 101,440 logic elements and approximately 4.98 Mbits of embedded memory for consolidated digital designs.

Designed as a commercial-grade, surface-mount FPGA, this device supports designs that require substantial logic capacity, significant on-chip memory, and a large number of user I/Os while operating within a low-voltage core range.

Key Features

• Core Logic  101,440 logic elements supporting complex combinational and sequential designs.
• Embedded Memory  Approximately 4.98 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• I/O Density  300 user I/Os to support parallel interfaces and multiple peripheral connections.
• Package & Mounting  676-BGA (supplier package: 676-FBGA, 27 × 27 mm) optimized for surface-mount assembly in compact boards.
• Power  Core supply voltage range of 0.950 V to 1.05 V to match low-voltage system architectures.
• Operating Range  Commercial operating temperature range from 0 °C to 85 °C.
• Compliance  RoHS compliant for environmental requirements in commercial products.

Typical Applications

• Programmable Logic Integration  Consolidate custom digital functions and glue logic into a single FPGA to simplify system architecture.
• High‑I/O Interfaces  Implement multi-channel I/O bridging, protocol conversion, or parallel bus handling using the 300 user I/Os.
• On‑Chip Memory Utilization  Use the embedded RAM for buffering, FIFOs, and small data stores to reduce external memory dependency.

Unique Advantages

• High Logic Capacity: 101,440 logic elements enable integration of extensive custom logic and state machines in one device.
• Substantial Embedded Memory: Approximately 4.98 Mbits of on-chip RAM supports local data storage and reduces the need for external memory in many designs.
• Large I/O Count: 300 user I/Os provide flexibility for interfacing multiple peripherals and parallel buses without additional bridging components.
• Compact, Surface‑Mount Package: 676-BGA (27 × 27 mm) allows high-density PCB implementations while maintaining robust solderability for surface-mount manufacturing.
• Low‑Voltage Core: 0.950 V to 1.05 V supply range supports integration into modern low-voltage systems.
• RoHS Compliant: Meets environmental compliance requirements for commercial electronic products.

Why Choose XC7A100T-1FGG676C?

The XC7A100T-1FGG676C positions itself as a high-density, commercial-grade Artix-7 FPGA suited to designs that require extensive programmable logic, significant on-chip memory, and a high number of I/Os in a compact surface-mount package. Its combination of 101,440 logic elements, approximately 4.98 Mbits of embedded RAM, and 300 I/Os offers designers the ability to consolidate functions and reduce board-level complexity.

This device is appropriate for teams building scalable programmable designs that benefit from substantial local memory and I/O flexibility while operating within standard commercial temperature and low-voltage core constraints. RoHS compliance and a compact 676-BGA package support practical manufacturing and environmental requirements.

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