XC7A100T-1FGG676I

The XC7A100T-1FGG676I is an Artix‑7 Field Programmable Gate Array (FPGA) from AMD, offered in a 676-ball FBGA package. It provides a high-density logic fabric and embedded memory suitable for industrial applications that require configurable digital logic, flexible I/O, and robust operating temperature support.

This device targets designs that need substantial on-chip logic and RAM while maintaining a compact, surface‑mount form factor and a low-voltage core supply for efficient integration into system-level designs.

Key Features

• Logic Capacity Approximately 101,440 logic elements to implement complex digital functions and custom hardware accelerators.
• Embedded Memory Approximately 4.98 Mbits of on-chip RAM for buffering, FIFOs, and local data storage.
• I/O Resources 300 user I/O pins to support a wide range of external interfaces and parallel connectivity.
• Package 676-FBGA (27×27) package, providing a high pin-count in a compact surface-mount form factor.
• Power Core voltage supply range of 950 mV to 1.05 V to match system power architectures and manage power consumption.
• Temperature and Reliability Industrial operating temperature range of −40 °C to 100 °C for use in demanding environmental conditions.
• Mounting and Compliance Surface mount device with RoHS compliance for modern manufacturing and environmental requirements.

Typical Applications

• Industrial Control — Implement motor control logic, real-time sequencing, and deterministic control functions where an industrial temperature range is required.
• Data Aggregation & Interfaces — Aggregate sensor and bus data using abundant I/O and on-chip RAM for temporary buffering and protocol bridging.
• Signal Processing — Deploy custom digital signal processing blocks and pipeline architectures using the device’s logic capacity and embedded memory.
• Embedded System Prototyping — Use the FPGA’s reprogrammable fabric and high pin-count package for rapid hardware validation and subsystem integration.

Unique Advantages

• High logic density: Approximately 101,440 logic elements enable implementation of sizable custom logic and hardware accelerators on a single device.
• Substantial on-chip RAM: Approximately 4.98 Mbits of embedded memory supports buffering, look‑up tables, and state storage without external RAM.
• Robust industrial range: −40 °C to 100 °C rating provides thermal headroom for industrial and harsh-environment deployments.
• Generous I/O complement: 300 I/O pins give flexibility to connect multiple peripherals, buses, and sensors directly to the FPGA fabric.
• Compact high-pin-count package: 676-FBGA (27×27) allows high signal count while remaining suitable for dense PCB layouts and surface-mount assembly.
• Low-voltage core operation: 950 mV–1.05 V core supply aligns with modern power distribution strategies for efficient system design.

Why Choose XC7A100T-1FGG676I?

The XC7A100T-1FGG676I combines a large logic element count, meaningful embedded memory, and a high I/O complement in a compact 676-FBGA package, making it a practical choice for industrial-grade FPGA implementations that require on-board processing, protocol interfacing, or custom hardware acceleration. Its wide operating temperature range and surface-mount packaging simplify integration into industrial systems.

Designed and manufactured by AMD, this Artix‑7 device is suited for engineering teams building scalable, robust digital designs that benefit from reprogrammability and significant on-chip resources.

Request a quote or submit an inquiry today to obtain pricing and availability for the XC7A100T-1FGG676I for your next design.