XC7A100T-2CSG324I

IC FPGA 210 I/O 324CSBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 210 4976640 101440 324-LFBGA, CSPBGA

Quantity 1,235 Available (as of October 7, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSPBGA (15x15)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case324-LFBGA, CSPBGANumber of I/O210Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7925Number of Logic Elements/Cells101440
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4976640

Overview of XC7A100T-2CSG324I – Artix-7 Field Programmable Gate Array (FPGA)

The XC7A100T-2CSG324I is an Artix-7 FPGA in a 324‑LFBGA (324‑CSPBGA, 15×15) package, designed for industrial applications. It provides a high-density programmable fabric with 101,440 logic elements, approximately 4.98 Mbits of embedded memory, and 210 I/O pins to support complex digital logic, interfacing, and control tasks while operating over a wide temperature and supply range.

Key Features

  • Core Logic  101,440 logic elements providing a large programmable fabric for implementing complex digital designs.
  • On‑Chip Memory  Approximately 4.98 Mbits of embedded memory for buffering, state storage, and fast local data access.
  • I/O Density  210 user I/Os to support multiple interfaces, parallel buses, and mixed signal front‑end connections.
  • Power Supply  Operates from a core voltage supply range of 0.950 V to 1.05 V, enabling predictable power budgeting in system designs.
  • Package & Mounting  324‑LFBGA (supplier package: 324‑CSPBGA, 15×15) surface‑mount package for compact board layouts.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet industrial environment requirements.
  • Environmental Compliance  RoHS compliant.

Unique Advantages

  • High integration density: 101,440 logic elements and substantial embedded memory reduce the need for external logic and RAM components.
  • Flexible I/O support: 210 I/Os enable integration of multiple peripherals and interfaces directly on the FPGA fabric.
  • Compact system footprint: 324‑LFBGA / 324‑CSPBGA (15×15) packaging supports high functionality in a small board area.
  • Industrial reliability: Specified operation from −40 °C to 100 °C for robust performance in demanding environments.
  • Predictable power envelope: Narrow core supply range (0.950–1.05 V) helps simplify power‑supply design and thermal planning.
  • Regulatory readiness: RoHS compliance supports use in lead‑free manufacturing processes.

Why Choose XC7A100T-2CSG324I?

The XC7A100T-2CSG324I offers a balanced combination of logic capacity, on‑chip memory, and I/O density in an industrial‑grade package. Its specifications make it suitable for designs requiring substantial programmable logic and embedded RAM while meeting industrial temperature and RoHS requirements. Engineers and procurement teams can rely on this device when designing scalable, compact systems that demand predictable power and robust operation.

Request a quote or submit a purchasing inquiry to evaluate XC7A100T-2CSG324I for your next design and obtain pricing and availability details.

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