XC7A100T-2FG484I

IC FPGA 285 I/O 484FBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 285 4976640 101440 484-BBGA

Quantity 156 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGANumber of I/O285Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7925Number of Logic Elements/Cells101440
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4976640

Overview of XC7A100T-2FG484I – Artix-7 Field Programmable Gate Array (FPGA) 484-BBGA

The XC7A100T-2FG484I is an Artix-7 Field Programmable Gate Array (FPGA) IC offered in a 484-ball BGA package. It provides a high-density programmable fabric with a substantial number of logic elements, embedded memory, and a large I/O count suited for industrial applications.

With industrial-grade operating temperature and a compact surface-mount FBGA package, this device targets designs that require on-chip programmable logic, flexible I/O, and reliable operation across a wide temperature range.

Key Features

  • Logic Capacity  101,440 logic elements for implementing complex custom logic, state machines, and datapaths.
  • Programmable Fabric  Architecture provided by the Artix-7 family enabling user-defined digital logic integration on a single device.
  • Embedded Memory  Approximately 4.98 Mbits of on-chip RAM for buffering, FIFOs, and local storage of intermediate data.
  • I/O Density  285 user I/Os to support parallel interfaces, bus conversions, and dense signal interfacing.
  • Power and Core Voltage  Core voltage supply range of 0.95 V to 1.05 V to support low-voltage FPGA core operation and power budgeting.
  • Package and Mounting  484-ball BGA (supplier package: 484-FBGA, 23×23) in a surface-mount form factor for compact board integration.
  • Industrial Temperature Range  Rated for operation from −40 °C to 100 °C to meet demanding environmental conditions.
  • Regulatory Compliance  RoHS compliant to align with lead-free manufacturing and regulatory requirements.

Typical Applications

  • Industrial Control and Automation  Use the FPGA’s programmable logic and industrial temperature rating for deterministic control, I/O aggregation, and protocol bridging in factory and process automation.
  • Custom Embedded Logic  Implement application-specific datapaths, state machines, and peripheral interfaces where off-the-shelf ICs cannot meet unique requirements.
  • High-Density I/O Systems  Leverage 285 I/Os for systems requiring multiple parallel interfaces, mixed bus topologies, or dense sensor/actuator connectivity.
  • Prototyping and System Integration  Compact FBGA packaging and substantial logic/memory resources make the device suitable for board-level prototyping and integration of multiple functions into one programmable device.

Unique Advantages

  • Highly integrated logic and memory: Combine 101,440 logic elements with approximately 4.98 Mbits of embedded RAM to reduce external components and simplify system architecture.
  • Dense I/O capability: 285 I/Os enable flexible interfacing and reduce the need for external multiplexers or expanders.
  • Industrial-grade operation: −40 °C to 100 °C rating supports deployment in harsh or temperature-variable environments.
  • Compact surface-mount package: 484-ball BGA (23×23 FBGA) offers a space-efficient footprint for board-level integration.
  • Low-voltage core operation: 0.95 V to 1.05 V supply range supports power-conscious designs and predictable core power planning.
  • RoHS compliance: Meets lead-free manufacturing requirements for modern production processes.

Why Choose XC7A100T-2FG484I?

The XC7A100T-2FG484I positions a substantial programmable fabric, embedded memory, and high I/O density within a compact FBGA package rated for industrial temperatures. It is well suited for engineers and designers who need to consolidate custom logic, buffering, and multiple interfaces into a single device while maintaining board-space efficiency and RoHS compliance.

This part offers a balance of logic capacity, on-chip memory, and I/O resources for long-term deployments in industrial systems and embedded integration tasks where programmable flexibility and environmental robustness are important.

If you would like pricing, availability, or to request a quote for the XC7A100T-2FG484I, please submit a quote request or sales inquiry detailing your quantity and delivery requirements.

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