XC7A100T-2FGG676CES9937

IC FPGA 300 I/O 676FBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 300 4976640 101440 676-BGA

Quantity 1,022 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package676-FBGA (27x27)GradeCommercialOperating Temperature0°C – 85°C
Package / Case676-BGANumber of I/O300Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7925Number of Logic Elements/Cells101440
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4976640

Overview of XC7A100T-2FGG676CES9937 – Artix-7 FPGA, 101,440 logic elements, 676‑BGA

The XC7A100T-2FGG676CES9937 is an Artix‑7 field programmable gate array (FPGA) IC manufactured by AMD, offering a commercial‑grade programmable logic solution in a compact ball grid array package. Its architecture combines a high logic element count with embedded memory and a substantial I/O bank to support complex, reconfigurable digital designs.

Designed for commercial applications, this device provides a balance of logic density, on‑chip memory and I/O capacity while operating from a 0.95 V to 1.05 V core supply and across a 0 °C to 85 °C temperature range.

Key Features

  • Device Family: Artix‑7 field programmable gate array from AMD, provided as a surface‑mount IC for board‑level integration.
  • Logic Capacity: Approximately 101,440 logic elements, enabling substantial digital logic integration on a single device.
  • Configurable Logic Blocks (CLBs): 7,925 CLBs to structure and distribute logic resources across the device.
  • Embedded Memory: Approximately 4.98 Mbits of on‑chip RAM for data buffering, state storage and local memory needs.
  • I/O Count: 300 general‑purpose I/O pins to support multiple external interfaces and parallel connections.
  • Power and Core Voltage: Core voltage supply range of 0.95 V to 1.05 V for the programmable logic fabric.
  • Package & Mounting: 676‑BGA package (supplier package 676‑FBGA, 27×27) in a surface‑mount form factor for dense PCB layouts.
  • Operating Range & Grade: Commercial grade with an operating temperature range of 0 °C to 85 °C.
  • Environmental Compliance: RoHS compliant.

Typical Applications

  • Commercial embedded systems — Suited for designs that require up to 101,440 logic elements and up to 300 I/O in a single programmable device.
  • Prototyping and development platforms — Provides a reconfigurable resource pool with significant on‑chip memory for iterative hardware and firmware development.
  • High‑density I/O and interface bridging — 300 available I/O pins accommodate multiple parallel interfaces and board‑level signal routing needs.

Unique Advantages

  • High logic density: Approximately 101,440 logic elements enable consolidation of complex digital functions onto one FPGA, reducing board-level component count.
  • Substantial embedded memory: Around 4.98 Mbits of on‑chip RAM supports local buffering, state machines and data handling without external memory in many designs.
  • Wide I/O capacity: 300 I/O pins provide flexibility for interfacing with multiple peripherals, sensors and high‑pin‑count connectors.
  • Compact package: 676‑BGA (27×27) offers a dense footprint for space‑constrained PCBs while supporting surface‑mount assembly.
  • Commercial temperature and RoHS compliance: Operates across 0 °C to 85 °C and meets RoHS requirements for environmentally compliant manufacturing.

Why Choose XC7A100T-2FGG676CES9937?

The XC7A100T‑2FGG676CES9937 positions itself as a commercial‑grade Artix‑7 FPGA that combines a large logic resource pool, several megabits of embedded memory and a high I/O count in a 676‑BGA surface‑mount package. These attributes make it well suited to consolidating complex digital functions, supporting memory‑intensive kernels and handling extensive interfacing requirements on a single programmable device.

For design teams seeking a reconfigurable solution with verified environmental compliance, predictable operating limits and a compact package outline, this FPGA offers a clear, specification‑driven option that supports scalable development and integration into commercial products.

Request a quote or submit an inquiry to receive pricing and availability information for the XC7A100T-2FGG676CES9937.

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