XC7A100T-2FGG676C

The XC7A100T-2FGG676C is an Artix-7 Field Programmable Gate Array (FPGA) offering a high logic element count and substantial on-chip memory in a compact BGA package. It provides 101,440 logic elements, approximately 4.98 Mbits of embedded memory, and 300 user I/O pins to support dense, board-level programmable logic implementations.

Designed as a commercial-grade, surface-mount FPGA, this device operates from a core voltage of 0.95 V to 1.05 V and is specified for operation from 0 °C to 85 °C. The 676-FBGA (27×27) package enables space-efficient integration on moderately constrained PCBs.

Key Features

• Core Logic  101,440 logic elements for implementing complex digital designs and flexible hardware acceleration.
• Embedded Memory  Approximately 4.98 Mbits of on-chip RAM to support buffering, packet processing, and local data storage.
• I/O Capacity  300 user I/O pins provide broad interfacing capability for peripherals, sensors, and external devices.
• Power Supply  Core voltage range of 0.95 V to 1.05 V to match low-voltage FPGA power domains and designs.
• Package & Mounting  676-FBGA (27×27) package in a surface-mount form factor for compact board integration.
• Operating Range & Grade  Commercial grade device specified for 0 °C to 85 °C operation.
• Standards Compliance  RoHS compliant for reduced hazardous substance content.

Typical Applications

• Programmable Logic and Prototyping  Use the FPGA’s 101,440 logic elements and reprogrammable nature for hardware prototyping and iterative design validation.
• Data Buffering and On‑chip Storage  Approximately 4.98 Mbits of embedded memory supports buffering and local data handling in packet or stream processing tasks.
• High‑density I/O Interfaces  With 300 I/O pins, the device is suited for applications requiring multiple peripheral interfaces or parallel signal connectivity.
• Space‑constrained Board Designs  The 676-FBGA (27×27) surface-mount package enables compact integration on PCBs where board area is limited.

Unique Advantages

• High Logic Capacity: 101,440 logic elements enable implementation of sizable custom logic blocks and mixed-function designs without external gate arrays.
• Substantial On‑chip Memory: Approximately 4.98 Mbits of embedded RAM reduces reliance on external memory for many buffering and state storage needs.
• Extensive I/O Count: 300 user I/Os provide flexibility for interfacing to multiple peripherals, sensors, and external controllers.
• Compact Packaging: 676-FBGA (27×27) packaging offers a balance of pin count and board-space efficiency for dense system designs.
• RoHS Compliance: Environmentally compliant construction aligns with lead-free manufacturing requirements.
• Commercial Temperature Rating: Specified operation from 0 °C to 85 °C for standard commercial applications and deployments.

Why Choose XC7A100T-2FGG676C?

The XC7A100T-2FGG676C positions itself as a versatile, commercially graded Artix-7 FPGA that combines high logic density, significant embedded memory, and broad I/O capability in a compact 676-FBGA package. Its core voltage range and surface-mount format make it suitable for modern board-level designs that require reconfigurable logic and local memory resources.

This device is well suited for engineers and teams developing complex digital systems who need a single-chip solution to consolidate logic, interface numerous peripherals, and maintain a compact PCB footprint. Its RoHS compliance and defined commercial temperature range support long-term production and deployment in standard commercial environments.

If you would like pricing, availability, or to submit a quote request for the XC7A100T-2FGG676C, please request a quote or contact our sales team for further assistance.