XC7A100T-2FGG676I

The XC7A100T-2FGG676I is an Artix-7 Field Programmable Gate Array (FPGA) IC designed for industrial applications. It provides a high-density programmable logic fabric with 101,440 logic elements, approximately 4.98 Mbits of embedded memory, and up to 300 user I/O pins for flexible system integration.

Packaged in a 676‑ball FBGA (676‑BGA, 27x27) surface-mount package and specified for an operating range of -40°C to 100°C, this device targets designs that require programmable logic, on-chip memory, and substantial I/O capability within an industrial temperature window.

Key Features

• Logic Capacity — 101,440 logic elements supporting complex programmable logic implementations.
• Embedded Memory — Approximately 4.98 Mbits of on-chip RAM suitable for buffering, FIFOs, and local data storage.
• I/O Density — 300 user I/O pins to support multiple interfaces and external peripheral connections.
• Package & Mounting — 676‑FBGA (27x27) package case in a surface-mount form factor for board-level integration.
• Power — Core supply specified from 950 mV to 1.05 V to match system power rails and power-management schemes.
• Temperature & Grade — Industrial grade device rated for operation from -40°C to 100°C.
• Environmental Compliance — RoHS compliant for regulatory and manufacturing compatibility.

Unique Advantages

• High Logic Density: 101,440 logic elements provide headroom for complex state machines, custom processing, and protocol bridging without external logic.
• Significant On-Chip Memory: Approximately 4.98 Mbits of embedded RAM reduces dependence on external memory for buffering and local storage, simplifying BOM and board routing.
• Robust I/O Count: 300 I/O pins enable integration of multiple parallel interfaces, sensor arrays, or mixed-signal front ends without extensive external multiplexing.
• Industrial Temperature Range: Specified for -40°C to 100°C operation, supporting deployment in industrial environments and temperature-variable installations.
• Compact FBGA Package: 676‑FBGA (27x27) surface-mount package supports dense board layouts while providing the pin count required for complex designs.
• Regulatory Readiness: RoHS compliance helps streamline manufacturing and environmental conformity requirements.

Why Choose XC7A100T-2FGG676I?

The XC7A100T-2FGG676I balances high programmable logic capacity, meaningful embedded memory, and substantial I/O in a compact 676‑FBGA package, tailored for industrial-grade applications. Its supply voltage and operating temperature range make it suitable for designs that require stable core power and reliable operation across standard industrial conditions.

This part is well suited for engineering teams and procurement looking for a scalable, programmable solution that delivers on-chip resources to reduce external component count and simplify board design while meeting environmental compliance needs.

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