XC7A100T-2FTG256I
| Part Description |
Artix-7 Field Programmable Gate Array (FPGA) IC 170 4976640 101440 256-LBGA |
|---|---|
| Quantity | 60 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 256-FTBGA (17x17) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-LBGA | Number of I/O | 170 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 7925 | Number of Logic Elements/Cells | 101440 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4976640 |
Overview of XC7A100T-2FTG256I – Artix-7 Field Programmable Gate Array (FPGA) IC 170 4976640 101440 256-LBGA
The XC7A100T-2FTG256I is an Artix‑7 field programmable gate array from AMD, supplied in a 256‑ball LBGA surface‑mount package. It is specified as an industrial‑grade device with a core supply range of 0.95 V to 1.05 V and an operating temperature range of −40 °C to 100 °C.
Designed to provide on‑chip programmable logic and memory, this device offers 101,440 logic elements and approximately 4.98 Mbits of embedded memory, along with 170 user I/O pins for external interfacing.
Key Features
- Core Logic 101,440 logic elements (cells) for implementing custom digital functions and combinational/sequential logic.
- Embedded Memory Approximately 4.98 Mbits of on‑chip RAM to support data buffering, state storage, and embedded processing needs.
- I/O Capacity 170 user I/O pins to accommodate multiple external interfaces and moderate I/O‑dense designs.
- Power Core voltage supply range from 0.95 V to 1.05 V, allowing integration into designs with controlled core power rails.
- Package & Mounting 256‑LBGA (256‑FTBGA 17×17) surface‑mount package for compact board integration and high I/O density.
- Industrial Temperature Grade Specified operating temperature range of −40 °C to 100 °C for use in thermally demanding environments.
- Regulatory Compliance RoHS‑compliant construction.
Typical Applications
- Industrial and embedded systems — Use the industrial temperature rating and logic capacity for controller and automation designs operating between −40 °C and 100 °C.
- Custom digital logic and prototyping — Implement complex, application‑specific logic with 101,440 logic elements and on‑chip memory for state and buffering.
- I/O‑intensive interfaces — Leverage 170 user I/Os in the 256‑LBGA package for designs that require multiple external connections or peripheral interfaces.
- Compact system integration — Surface‑mount 256‑LBGA package enables space‑constrained PCB layouts while preserving substantial logic and memory resources.
Unique Advantages
- Substantial programmable logic: 101,440 logic elements provide the capacity to implement sizeable custom digital designs without external glue logic.
- Significant embedded memory: Approximately 4.98 Mbits of on‑chip RAM reduces reliance on external memory for many buffering and storage needs.
- Broad I/O count in a compact package: 170 I/Os in a 256‑LBGA form factor balance external connectivity with board space efficiency.
- Industrial‑grade temperature range: −40 °C to 100 °C supports deployment in harsher operating environments.
- Controlled core power envelope: 0.95 V to 1.05 V supply range aligns with systems designed for regulated core voltages.
- RoHS compliant: Meets lead‑free environmental requirements for modern electronics manufacturing.
Why Choose XC7A100T-2FTG256I?
The XC7A100T-2FTG256I positions itself as an industrial‑grade Artix‑7 FPGA option that combines a large logic resource pool, multiple megabits of embedded memory, and a substantial I/O count in a compact 256‑LBGA package. Its specified operating range and RoHS compliance make it suitable for designs that require reliable operation across a wide temperature span and adherence to environmental manufacturing standards.
This device is suitable for engineers and teams seeking a programmable hardware building block that integrates logic, memory, and I/O density for embedded and industrial applications while maintaining a compact board footprint and controlled core voltage requirements.
Request a quote or submit an inquiry to get pricing and availability information for the XC7A100T-2FTG256I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
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Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








