XC7A100T-3FGG676E

The XC7A100T-3FGG676E is an Artix-7 Field Programmable Gate Array (FPGA) manufactured by AMD. It provides a large logic fabric and on-chip memory in a compact 676-ball BGA package intended for surface-mount assembly.

Key technical characteristics include 7,925 configurable logic blocks (CLBs) equivalent to 101,440 logic elements, approximately 4.98 Mbits of embedded RAM, up to 300 I/O pins, a core supply range of 0.95–1.05 V, and an operating temperature range of 0°C to 100°C for extended-grade applications.

Key Features

• Logic Resources  7,925 CLBs and 101,440 logic elements provide substantial programmable fabric for complex logic, DSP, and control functions.
• On‑Chip Memory  Approximately 4.98 Mbits of embedded RAM suitable for buffering, FIFOs, and local data storage within the FPGA fabric.
• I/O Capacity  Up to 300 I/O pins to support a wide range of external interfaces and parallel connectivity requirements.
• Package  676-FBGA (27×27) / 676‑BGA package case designed for surface-mount PCB integration where board space and routing density are considerations.
• Power  Core voltage supply range of 0.95 V to 1.05 V, enabling predictable power budgeting for the FPGA core.
• Temperature & Grade  Extended-grade device with an operating temperature range of 0°C to 100°C.
• Compliance  RoHS compliant.

Unique Advantages

• High logic capacity: 101,440 logic elements and 7,925 CLBs enable implementation of substantial custom logic and complex finite-state machines without external programmable logic.
• Significant embedded memory: Approximately 4.98 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage tasks, simplifying board design.
• Ample I/O flexibility: Up to 300 available I/O pins allow multiple peripheral interfaces and high-pin-count connectivity directly from the device.
• Compact, manufacturable package: 676-FBGA (27×27) surface-mount package supports high-density routing while keeping PCB footprint controlled for space-constrained designs.
• Predictable power envelope: Defined core supply range (0.95–1.05 V) aids in power supply design and thermal planning for the FPGA core.
• Extended-grade operation: Rated for 0°C to 100°C operation, suitable for applications requiring broader commercial temperature performance.

Why Choose XC7A100T-3FGG676E?

The XC7A100T-3FGG676E combines a large logic fabric, substantial embedded RAM, and up to 300 I/O in a 676‑ball BGA package, making it well suited for designs that require significant programmable logic and on-chip memory in a compact surface-mount form factor. Manufactured by AMD and provided as an extended-grade, RoHS-compliant device, it is positioned for applications that need measurable logic capacity, memory, and connectivity while maintaining defined power and temperature specifications.

For designs that demand substantial on-chip resources in a single device footprint, the XC7A100T-3FGG676E offers a clear specification set—logic elements, embedded RAM, I/O count, package, and operating ranges—that can be used directly in component selection and system planning.

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