XC7A100T-L1CSG324I

The XC7A100T-L1CSG324I is an Artix-7 field programmable gate array (FPGA) IC from AMD offered in a 324-pin LFBGA/CSPBGA package. As an industrial-grade, surface-mount FPGA, it delivers a large logic capacity and substantial on-chip memory in a compact 15 × 15 mm package footprint.

Key attributes include 101,440 logic elements, approximately 4.98 Mbits of embedded memory, and 210 user I/O pins, with a core voltage range of 0.95–1.05 V and an operating temperature range of −40 °C to 100 °C—making it suitable for industrial designs that require reconfigurable logic and robust thermal operation.

Key Features

• Logic Capacity  Provides 101,440 logic elements to implement complex custom logic, state machines, and datapath functions.
• Embedded Memory  Includes approximately 4.98 Mbits of on-chip RAM for buffering, temporary storage, and local data handling.
• I/O Resources  Features 210 user I/O pins to support multiple interfaces and peripheral connections.
• Power  Core supply operates in the 0.95 V to 1.05 V range, enabling compatibility with low-voltage system architectures.
• Package & Mounting  324-pin CSPBGA/LFBGA package (324-CSPBGA, 15×15 mm) in a surface-mount form factor for compact PCB integration.
• Temperature Range  Industrial operating temperature from −40 °C to 100 °C for use in temperature-challenging environments.
• Compliance  RoHS-compliant construction for regulatory and manufacturing alignment.

Typical Applications

• Industrial Control and Automation  Implements custom control logic, I/O aggregation, and real-time decision-making within industrial systems, leveraging the wide operating temperature and high I/O count.
• Embedded Signal Processing  Hosts custom datapaths and buffering using the device's large pool of logic elements and embedded RAM for signal conditioning and preprocessing.
• I/O Bridging and Protocol Conversion  Consolidates multiple peripheral interfaces and bridges different bus protocols using abundant I/O and programmable logic resources.
• Compact System Integration  Fits high-density logic into space-constrained PCBs with its 324-CSPBGA surface-mount package.

Unique Advantages

• High Logic Density: 101,440 logic elements enable implementation of sophisticated custom logic and feature-rich designs without external ASICs.
• Substantial On‑Chip Memory: Approximately 4.98 Mbits of embedded RAM reduces dependence on external memory for buffering and local data storage.
• Rich I/O Count: 210 I/O pins give flexibility to connect sensors, actuators, and high-pin-count interfaces directly to the FPGA.
• Industrial Temperature Capability: Rated from −40 °C to 100 °C to support deployment in demanding industrial environments.
• Compact Surface-Mount Package: 324-CSPBGA (15×15 mm) packaging enables high-density PCB layouts while maintaining robust solderable mounting.
• RoHS Compliance: Manufactured to meet RoHS requirements for environmentally conscious designs.

Why Choose XC7A100T-L1CSG324I?

The XC7A100T-L1CSG324I positions itself as a high-capacity, industrial-grade FPGA option that combines large programmable logic resources, meaningful on-chip memory, and a high I/O count in a compact surface-mount package. Its wide operating temperature range and RoHS compliance make it suitable for engineers targeting reliable, reconfigurable solutions in industrial and embedded systems.

Engineers and procurement teams looking for a scalable, high-density FPGA from AMD can leverage this device to consolidate functionality, reduce board-level BOM, and support designs that require both dense logic and robust environmental performance.

Request a quote or submit a pricing and availability inquiry to receive detailed lead-time and purchasing information for the XC7A100T-L1CSG324I.