XC7A100T-3FTG256E

The XC7A100T-3FTG256E is an AMD Artix-7 field programmable gate array (FPGA) offered in a 256-LBGA surface-mount package. It provides a large programmable fabric with 101,440 logic elements and approximately 4.98 Mbits of embedded memory for implementing complex digital logic and buffering within a compact footprint.

With 170 user I/Os, a low core voltage range (0.95 V to 1.05 V), and extended-grade temperature capability, this device is suited to designs that require substantial logic capacity, moderate on-chip RAM, and flexible I/O in a space-efficient package.

Key Features

• Core Logic  101,440 logic elements for implementing complex custom logic, state machines, and parallel processing.
• Embedded Memory  Approximately 4.98 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage.
• I/O Density  170 user I/Os to support multiple interfaces, peripherals, and external device connectivity.
• Power  Core voltage supply range of 0.95 V to 1.05 V to match system power-rail requirements for low-voltage FPGA cores.
• Package & Mounting  256-LBGA surface-mount package (supplier device package: 256-FTBGA, 17×17) for compact board-level integration.
• Temperature & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C.
• Compliance  RoHS compliant for soldering and assembly in standard lead-free manufacturing processes.

Typical Applications

• Embedded Systems  Use the programmable fabric and on-chip RAM to implement application-specific processing, control logic, and protocol handling in embedded devices.
• Communications & Networking  Leverage the 170 I/Os and large logic capacity for custom packet processing, interfacing, and protocol bridging.
• Signal Processing  Implement parallel signal processing pipelines and buffering using the device’s logic resources and embedded memory.
• Video & Imaging  Deploy the FPGA’s logic and RAM for frame buffering, stream reformatting, and real-time preprocessing tasks.

Unique Advantages

• High Logic Capacity: 101,440 logic elements enable substantial on-chip implementation of custom functions and parallel architectures.
• Significant On-Chip Memory: Approximately 4.98 Mbits of embedded RAM reduces reliance on external memory for intermediate buffering and data staging.
• Flexible Connectivity: 170 I/Os provide broad interfacing options for sensors, peripherals, and external devices without extensive I/O expansion.
• Compact, Surface-Mount Packaging: The 256-LBGA (256-FTBGA, 17×17) package supports dense PCB designs and automated assembly processes.
• Low-Voltage Core: Core supply range of 0.95 V to 1.05 V aligns with modern low-voltage power architectures.
• Extended Operating Range: Rated for 0 °C to 100 °C operation and offered in an extended grade for a wider range of board-level use cases.

Why Choose XC7A100T-3FTG256E?

The XC7A100T-3FTG256E combines a high-density programmable fabric, meaningful on-chip memory, and a substantial I/O complement in a compact 256-LBGA package. Its configuration is well suited to designers who need to consolidate logic, buffering, and interface functions on a single FPGA while maintaining a small board footprint.

With RoHS compliance and an extended operating temperature range, this Artix-7 device delivers a balanced mix of integration, I/O flexibility, and assembly-friendly packaging for a range of embedded and communications-focused designs.

Request a quote or submit a procurement inquiry for the XC7A100T-3FTG256E to receive pricing and availability details.