XC7A100T-L1FTG256I

IC FPGA 170 I/O 256FTBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 170 4976640 101440 256-LBGA

Quantity 1,626 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case256-LBGANumber of I/O170Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7925Number of Logic Elements/Cells101440
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits4976640

Overview of XC7A100T-L1FTG256I – Artix-7 FPGA, 170 I/O, 256-LBGA

The XC7A100T-L1FTG256I is an Artix-7 field programmable gate array (FPGA) IC provided in a 256-LBGA package. This industrial-grade device offers 101,440 logic elements, approximately 4.98 Mbits of embedded memory, and 170 user I/Os.

Designed for systems that require significant on-chip logic and memory within a compact surface-mount package, the device operates from a core supply of 0.95–1.05 V and across an industrial temperature range of −40 °C to 100 °C. The part is RoHS compliant.

Key Features

  • Core Logic 101,440 logic elements for implementing complex digital functions and custom logic blocks.
  • Embedded Memory Approximately 4.98 Mbits of on-chip RAM to support buffering, state machines, and local data storage.
  • I/O Capacity 170 user I/Os to enable connectivity with multiple peripherals and interfaces.
  • Power Core voltage supply range of 0.95–1.05 V to match low-voltage system domains.
  • Package & Mounting Supplied in a 256-LBGA package (supplier device package: 256-FTBGA, 17×17) and intended for surface-mount assembly.
  • Operating Range Industrial operating temperature from −40 °C to 100 °C for deployment in temperature-challenging environments.
  • Environmental Compliance RoHS compliant.

Unique Advantages

  • High logic density: 101,440 logic elements enable integration of substantial digital logic on a single device, reducing external component count.
  • Significant on-chip memory: Approximately 4.98 Mbits of embedded RAM supports local data storage and buffering needs without immediate external memory.
  • Wide I/O capability: 170 user I/Os provide flexibility to interface with multiple sensors, controllers, and peripheral devices.
  • Industrial temperature rating: −40 °C to 100 °C operation supports deployment in industrial and temperature-stressed applications.
  • Compact surface-mount packaging: 256-LBGA / 256-FTBGA (17×17) format enables space-efficient board-level integration.
  • Low-voltage core operation: 0.95–1.05 V core supply supports integration with modern low-voltage system designs.

Why Choose XC7A100T-L1FTG256I?

The XC7A100T-L1FTG256I combines a high logic element count, substantial embedded memory, and a large number of user I/Os within a compact 256-LBGA surface-mount package. Its industrial temperature range and low-voltage core supply make it well suited to designs that require reliable, high-density programmable logic in constrained board space.

This Artix-7 device is appropriate for engineers and procurement teams looking for a RoHS-compliant, industrial-grade FPGA option that provides on-chip resources to consolidate functions and simplify board-level designs.

Request a quote or submit an inquiry to receive pricing and availability information for the XC7A100T-L1FTG256I.

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