XC7A100T-L2FGG676E

The XC7A100T-L2FGG676E is an Artix-7 Field Programmable Gate Array (FPGA) IC from AMD. It provides 101,440 logic elements, approximately 4.98 Mbits of embedded memory, and 300 user I/O in a 676-ball BGA package.

Designed for applications that require programmable digital logic, on-chip RAM and moderate I/O density, this device operates from a core voltage range of 0.95 V to 1.05 V and is specified for an operating temperature range of 0 °C to 100 °C.

Key Features

• Logic Capacity  A total of 101,440 logic elements for implementing custom digital logic and state machines.
• Embedded Memory  Approximately 4.98 Mbits of on-chip RAM to support buffering, FIFOs and local data storage.
• I/O  300 user I/O pins to support a range of parallel and serial interfaces or multiple peripheral connections.
• Package  676-ball BGA (676-FBGA, 27×27) surface-mount package to enable compact board integration with high pin density.
• Power  Core supply voltage range of 0.95 V to 1.05 V for compatibility with low-voltage power domains.
• Temperature & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Regulatory  RoHS-compliant manufacturing.

Typical Applications

• Custom digital processing  Implement application-specific datapaths and control logic using the device's 101,440 logic elements and embedded memory.
• On-board buffering and data handling  Use approximately 4.98 Mbits of on-chip RAM for FIFOs, packet buffering and temporary storage close to the logic.
• Multi-interface systems  Leverage 300 I/O pins to connect sensors, peripherals, or parallel interfaces in compact designs.

Unique Advantages

• High logic density: 101,440 logic elements enable complex digital designs without external programmable logic.
• Substantial embedded memory: Approximately 4.98 Mbits of on-chip RAM reduces reliance on external memory for many buffering tasks.
• Generous I/O count: 300 user I/O pins provide flexibility for interfacing multiple peripherals or high-pin-count buses.
• Compact BGA footprint: 676-FBGA (27×27) package balances I/O density with board space efficiency for compact systems.
• Low-voltage core operation: Core supply range of 0.95 V–1.05 V supports integration with low-voltage power architectures.
• Extended temperature grade: Rated for 0 °C to 100 °C operation to match a range of commercial and extended-environment applications.

Why Choose XC7A100T-L2FGG676E?

The XC7A100T-L2FGG676E combines substantial programmable logic capacity, nearly 5 Mbits of embedded RAM and a 300-pin I/O complement in a compact 676-ball BGA package. Its low-voltage core range and extended temperature rating make it suitable for designs that need significant on-chip logic and memory while maintaining a small board footprint.

This device is appropriate for engineers and teams implementing custom digital functions, on-board buffering, and multi-interface systems who require predictable, verifiable device characteristics tied directly to published specifications.

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