XC7A12T-1CPG236I

The XC7A12T-1CPG236I is an AMD Artix-7 Field Programmable Gate Array (FPGA) in a 238-LFBGA / 238-CSBGA (10×10) package. It provides 12,800 logic elements and approximately 0.74 Mbits of embedded memory in a compact surface-mount form factor.

Designed for industrial-grade applications, this device operates from a core supply range of 0.95 V to 1.05 V and supports an operating temperature range of −40 °C to 100 °C, making it suitable for systems that require robust thermal performance and a moderate logic and memory footprint.

Key Features

• Logic Capacity — 12,800 logic elements for implementing mid-density digital designs and custom logic functions.
• Embedded Memory — Total on-chip RAM of 737,280 bits, providing approximately 0.74 Mbits of embedded memory for buffering, FIFOs, and small data stores.
• I/O Density — 106 general-purpose I/O pins to support multiple peripheral interfaces and board-level connectivity options.
• Power — Core voltage supply range of 0.95 V to 1.05 V, enabling defined low-voltage operation for the FPGA core.
• Package and Mounting — 238-LFBGA / CSPBGA package (238-CSBGA, 10×10) in a surface-mount configuration for compact PCB integration.
• Industrial Temperature Range — Rated for operation from −40 °C to 100 °C for deployment in temperature-challenged environments.
• Regulatory Compliance — RoHS compliant, meeting standard environmental directives for lead-free assembly.

Typical Applications

• Industrial Control — Use in automation and control systems that require industrial temperature performance and a moderate logic capacity for custom control logic.
• Embedded Processing — Suitable for embedded platforms needing on-chip memory (approximately 0.74 Mbits) and 12,800 logic elements to implement custom datapaths and state machines.
• I/O-Concentrated Interfaces — Ideal for designs that need up to 106 I/O pins for sensor aggregation, board-level peripherals, or mixed-signal front-ends.
• Compact, Surface-Mount Designs — The 238-LFBGA / 238-CSBGA (10×10) package supports space-constrained PCBs and surface-mount assembly processes.

Unique Advantages

• Balanced Logic and Memory — 12,800 logic elements combined with approximately 0.74 Mbits of RAM provide a balanced platform for mid-density FPGA designs without excessive area or cost.
• High I/O Count — 106 I/O pins enable integration of multiple interfaces and peripherals, reducing the need for external I/O expanders.
• Industrial-Grade Temperature Rating — Rated for −40 °C to 100 °C operation, supporting deployment in industrial environments where extended temperature ranges are required.
• Compact Surface-Mount Packaging — The 238-LFBGA / 238-CSBGA (10×10) package supports compact PCB layouts and modern assembly techniques.
• Defined Low-Voltage Core — Core supply range of 0.95 V to 1.05 V supports designs targeting low-voltage FPGA cores and stable power budgeting.
• RoHS Compliant — Environmentally compliant for lead-free assembly and standard regulatory expectations.

Why Choose XC7A12T-1CPG236I?

The XC7A12T-1CPG236I positions itself as a practical Artix-7 FPGA option for mid-density logic and embedded designs that require a moderate amount of on-chip memory, a high count of I/O, and industrial-temperature robustness. Its compact 238-LFBGA / CSPBGA package and surface-mount mounting make it suitable for constrained board layouts where space and integration matter.

This device is a fit for design teams needing a reliable, industrial-grade FPGA building block with defined supply and thermal parameters, enabling predictable system integration and long-term product support within those design constraints.

Request a quote or submit your project details to receive pricing and availability for the XC7A12T-1CPG236I. Our team can provide lead-time information and assistance to help integrate this Artix-7 FPGA into your design.