XC7A100T-3CSG324E

IC FPGA 210 I/O 324CSBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 210 4976640 101440 324-LFBGA, CSPBGA

Quantity 273 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSPBGA (15x15)GradeExtendedOperating Temperature0°C – 100°C
Package / Case324-LFBGA, CSPBGANumber of I/O210Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs7925Number of Logic Elements/Cells101440
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4976640

Overview of XC7A100T-3CSG324E – Artix-7 FPGA, 101,440 logic elements, ~4.98 Mbits RAM, 210 I/O, 324-LFBGA

The XC7A100T-3CSG324E is an AMD Artix-7 field programmable gate array (FPGA) in a 324-LFBGA (324-CSPBGA, 15×15) surface-mount package. It provides a combination of high logic capacity, embedded memory, and a substantial I/O count for configurable digital designs.

Key device characteristics include 101,440 logic elements, approximately 4.98 Mbits of on-chip RAM, 210 user I/Os, a supply voltage range of 0.95 V to 1.05 V, and an operating temperature range of 0 °C to 100 °C. The device is RoHS compliant and supplied by AMD.

Key Features

  • Logic Capacity  101,440 logic elements provide substantial programmable logic resources for complex designs.
  • Configurable Logic Blocks (CLBs)  7,925 CLBs are included to structure and organize logic functions across the device.
  • Embedded Memory  Approximately 4.98 Mbits of on-chip RAM support buffering, state machines, and local data storage.
  • I/O Resources  210 user I/O pins enable broad connectivity to external peripherals and interfaces.
  • Power Supply  Core supply range of 0.95 V to 1.05 V to match standard low-voltage FPGA power domains.
  • Package & Mounting  324-LFBGA (324-CSPBGA, 15×15) surface-mount package offers a compact footprint for board-level integration.
  • Temperature & Grade  Extended-grade device rated for operation from 0 °C to 100 °C, suitable for a wide range of commercial environments.
  • Environmental Compliance  RoHS compliant, meeting common environmental requirements for electronic components.

Unique Advantages

  • High programmable density: 101,440 logic elements enable complex logic implementation without external ASICs or glue logic.
  • On-chip memory for system efficiency: Approximately 4.98 Mbits of embedded RAM reduce reliance on external memory and simplify board design.
  • Ample I/O count: 210 user I/Os support multiple parallel interfaces and peripheral connections from a single device.
  • Compact, board-ready package: 324-LFBGA (15×15) surface-mount package balances pin count and PCB real estate for dense designs.
  • Designed for low-voltage operation: Core supply between 0.95 V and 1.05 V aligns with modern power-rail architectures.
  • Regulatory readiness: RoHS compliance eases use in environments with environmental and substance restrictions.

Why Choose XC7A100T-3CSG324E?

The XC7A100T-3CSG324E positions itself as a versatile Artix-7 FPGA option when substantial programmable logic, embedded memory, and a high I/O count are required in a compact surface-mount package. Its extended-grade operating range and RoHS compliance make it a practical choice for a variety of commercial designs that need significant on-chip resources and board-level integration.

This device suits engineering teams seeking a balance of logic capacity, embedded RAM, and connectivity while maintaining compact packaging and standard low-voltage power domains. Backed by AMD’s Artix-7 family pedigree, it integrates into existing FPGA development flows and design ecosystems.

Request a quote or submit an inquiry to receive pricing and availability information for the XC7A100T-3CSG324E. Our team can assist with lead times and ordering details.

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