XC7A35T-L1FTG256I

The XC7A35T-L1FTG256I is an Artix-7 Field Programmable Gate Array (FPGA) offered in a 256-LBGA package. It provides a combination of on-chip logic, embedded memory, and a substantive I/O complement targeted at industrial-grade implementations.

This device is specified for surface-mount applications, supports an operating temperature range from −40 °C to 100 °C, and operates with a core supply voltage between 0.95 V and 1.05 V, making it suitable for designs that require controlled core power and wide temperature tolerance.

Key Features

• Core Logic — 33,280 logic elements deliver the programmable fabric for implementing custom digital functions and control logic.
• Embedded Memory — Approximately 1.84 Mbits of on-chip RAM provide local storage for buffers, FIFOs, and temporary data to support complex logic blocks.
• I/O Resources — 170 I/O pins accommodate multiple external interfaces and signal routing without immediate need for external multiplexing.
• Package — 256-LBGA (supplier package: 256-FTBGA, 17×17) offers a compact, surface-mount footprint for space-conscious board designs.
• Power — Core voltage supply specified from 0.95 V to 1.05 V enables consistent power provisioning for the FPGA fabric.
• Temperature and Grade — Industrial grade device specified for −40 °C to 100 °C operation, suitable for deployments requiring extended temperature capability.
• Mounting and Compliance — Surface mount package and RoHS compliance support standard manufacturing processes and environmental regulatory requirements.

Typical Applications

• Industrial Control and Automation — Industrial-grade temperature range and 170 I/O pins support control systems, I/O aggregation, and machine-interface logic in factory environments.
• Data Acquisition and Sensor Interfaces — On-chip RAM and plentiful I/O enable local buffering and signal conditioning for sensor front ends and data capture tasks.
• Custom Embedded Logic and Prototyping — 33,280 logic elements and embedded memory allow implementation of custom digital blocks, protocol bridges, and prototype designs within a compact LBGA footprint.

Unique Advantages

• Substantial Logic Capacity — 33,280 logic elements provide headroom for integrating multiple functions into a single device, reducing component count.
• Embedded Memory for Local Storage — Approximately 1.84 Mbits of on-chip RAM reduces dependency on external memory for temporary data and buffering.
• Generous I/O Count — 170 I/O pins simplify system-level interfacing and reduce board-level routing complexity for multi-sensor or multi-peripheral designs.
• Compact, Manufacturable Package — The 256-LBGA / 256-FTBGA (17×17) package supports high-density board layouts and standard surface-mount assembly.
• Industrial Temperature Rating — Specified −40 °C to 100 °C operation supports deployments in demanding thermal environments.
• RoHS-Compliant — Conforms to RoHS environmental requirements for regulated markets and manufacturing processes.

Why Choose XC7A35T-L1FTG256I?

The XC7A35T-L1FTG256I combines a substantial programmable logic capacity with embedded memory and a broad I/O complement in a compact 256-LBGA package. Its industrial temperature rating and controlled core voltage range make it well suited for designs that require reliable operation across a wide thermal envelope and stable power profiles.

This device is appropriate for engineering teams seeking to consolidate custom logic, buffering, and interface functions into a single FPGA to reduce BOM complexity and support compact board layouts. Its RoHS compliance and surface-mount packaging align with standard manufacturing and environmental requirements.

Request a quote or submit your specifications to get pricing and availability for the XC7A35T-L1FTG256I. Our team can provide lead-time information and support procurement for your next design.