XC7A35T-L2FGG484E

IC FPGA 250 I/O 484FBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 250 1843200 33280 484-BBGA

Quantity 604 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeExtendedOperating Temperature0°C – 100°C
Package / CaseTrayNumber of I/O250Voltage950 mV
Mounting MethodSurface MountRoHS ComplianceN/AREACH ComplianceN/A
Moisture Sensitivity LevelN/ANumber of LABs/CLBs2600Number of Logic Elements/Cells33280
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits1843200

Overview of XC7A35T-L2FGG484E – Artix-7 Field Programmable Gate Array (FPGA) IC 250 1843200 33280 484-BBGA

The XC7A35T-L2FGG484E is an Artix-7 field programmable gate array (FPGA) optimized for applications that require a balance of logic capacity, embedded memory and I/O resources. This surface-mount FPGA provides a defined set of on-chip resources—logic elements, embedded RAM and a substantial I/O count—packaged in a 484-FBGA (23×23) footprint for compact system integration.

Specified with an extended grade and an operating range from 0 °C to 100 °C, the device targets designs that need predictable performance and on-board programmable logic in a tray-packaged 484-BBGA format.

Key Features

  • Core Logic 33,280 logic elements provide a programmable fabric for implementing custom logic, state machines and glue logic.
  • Configurable Logic Blocks (CLBs) The device includes 2,600 CLBs to structure and distribute logic resources across the FPGA fabric.
  • Embedded Memory Approximately 1.84 Mbits of on-chip RAM to support buffers, FIFOs and small lookup tables without external memory.
  • I/O Count 250 user I/O pins to interface with external devices, sensors and peripherals.
  • Supply Voltage Supply specified at 950 mV, consistent with the device’s core voltage requirement.
  • Package & Mounting 484-FBGA (23×23) supplier device package in a tray case, designed for surface-mount assembly.
  • Operating Conditions & Grade Extended-grade part with an operating temperature range of 0 °C to 100 °C.

Unique Advantages

  • Balanced logic and memory mix: The combination of 33,280 logic elements and approximately 1.84 Mbits of embedded RAM enables compact implementations of control, buffering and processing functions on a single device, reducing external component count.
  • High I/O capacity: 250 I/O pins support diverse peripheral and sensor interfaces without immediate need for I/O expansion devices.
  • Compact, production-friendly package: The 484-FBGA (23×23) package in tray format is suitable for surface-mount assembly and dense board layouts.
  • Deterministic supply requirement: Core supply specified at 950 mV to match system power design and simplify power budgeting.
  • Extended-grade operation: Rated for 0 °C to 100 °C operation, allowing deployment in systems that require a wider-than-commercial temperature range.

Why Choose XC7A35T-L2FGG484E?

The XC7A35T-L2FGG484E positions itself as a versatile Artix-7 FPGA option when designers need a measured combination of logic density, embedded memory and plentiful I/O in a compact FBGA package. Its specification set—33,280 logic elements, approximately 1.84 Mbits of on-chip RAM, 250 I/O and a 484-FBGA package—supports integration of programmable logic into space-constrained or board-level systems while keeping external component counts lower.

This device is suited for design teams and procurement professionals seeking a predictable, extended-grade FPGA solution with clear on-chip resources and a compact surface-mount package. The part’s specifications make it a practical choice for projects that demand integrated logic, memory and I/O capacity with defined thermal and power parameters.

Request a quote or submit an inquiry to obtain pricing, lead time and availability for the XC7A35T-L2FGG484E. Our response will include current stock and supply details to help you move forward with design and procurement planning.

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