XC7A50T-1CS324I

IC FPGA 210 I/O 324CSBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 210 2764800 52160 324-LFBGA, CSPBGA

Quantity 161 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSPBGA (15x15)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case324-LFBGA, CSPBGANumber of I/O210Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4075Number of Logic Elements/Cells52160
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits2764800

Overview of XC7A50T-1CS324I – Artix-7 Field Programmable Gate Array (324-LFBGA)

The XC7A50T-1CS324I is an Artix-7 Field Programmable Gate Array (FPGA) IC from AMD designed for industrial-grade embedded designs. It provides a balance of programmable logic, on-chip memory, and flexible I/O in a 324-pin LFBGA package for surface-mount assembly.

Key device attributes include 52,160 logic elements, approximately 2.76 Mbits of embedded memory, and up to 210 I/O pins, offering integration and configurability for a wide range of industrial applications that require robust temperature and voltage operating ranges.

Key Features

  • Programmable Logic  52,160 logic elements deliver configurable digital resources for implementing custom logic, datapaths, and control functions.
  • Embedded Memory  Approximately 2.76 Mbits of on-chip RAM to support buffering, lookup tables, and state storage without external memory.
  • I/O Capacity  Up to 210 user I/O pins provide broad interfacing capability for sensors, controllers, peripherals, and communication endpoints.
  • Power Supply Range  Core voltage support from 950 mV to 1.05 V enables stable operation within specified supply rails.
  • Package and Mounting  Supplied in a 324-LFBGA (324-CSPBGA, 15 × 15) package for surface-mount PCB assembly, balancing density and thermal performance.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet the demands of industrial environments.
  • RoHS Compliant  Manufactured in compliance with RoHS requirements for reduced hazardous substances.

Typical Applications

  • Industrial Control  Use the device’s industrial temperature rating, extensive I/O and programmable logic to implement motor control, PLC interfaces, and real-time control functions.
  • Communications Interface  Leverage the 210 I/O pins and on-chip memory for protocol bridging, custom framing, and interface adaptation between subsystems.
  • Signal Processing  Apply the available logic elements and embedded RAM for custom DSP pipelines, data buffering, and preprocessing in embedded systems.

Unique Advantages

  • Balanced Logic and Memory: 52,160 logic elements combined with approximately 2.76 Mbits of embedded RAM provide a balanced platform for mid-range FPGA designs without immediate need for external memory.
  • High I/O Count: Up to 210 I/Os simplify board-level integration by reducing the need for external multiplexing or expanders.
  • Industrial Reliability: Rated for −40 °C to 100 °C operation to support deployments in harsher ambient conditions common in industrial settings.
  • Compact, Surface-Mount Package: The 324-LFBGA (324-CSPBGA, 15 × 15) package delivers a compact footprint suitable for space-constrained PCBs while supporting surface-mount assembly.
  • Controlled Core Voltage Range: Defined core supply range (950 mV to 1.05 V) supports predictable power design and supply sequencing in system integration.
  • RoHS Compliance: Conforms to RoHS standards for reduced hazardous material content, simplifying environmental compliance.

Why Choose XC7A50T-1CS324I?

The XC7A50T-1CS324I positions itself as a practical, industrial-grade Artix-7 FPGA option for designers who need a solid mix of programmable logic, embedded memory, and high I/O in a compact surface-mount package. Its specification set—52,160 logic elements, approximately 2.76 Mbits of on-chip RAM, and up to 210 I/Os—supports a broad set of mid-range embedded designs where temperature range and package density matter.

This device is suitable for engineering teams seeking a reliable, scalable FPGA building block with clearly defined electrical and thermal envelopes, and RoHS compliance for environmentally conscious manufacturing.

Request a quote or submit an inquiry to our sales team to check availability and pricing for the XC7A50T-1CS324I.

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