XC7A50T-1CSG325I

IC FPGA 150 I/O 324CSBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 150 2764800 52160 324-LFBGA, CSPBGA

Quantity 326 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSPBGA (15x15)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case324-LFBGA, CSPBGANumber of I/O150Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4075Number of Logic Elements/Cells52160
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits2764800

Overview of XC7A50T-1CSG325I – Artix-7 FPGA, 324‑LFBGA, Industrial Grade

The XC7A50T-1CSG325I is an Artix‑7 field programmable gate array (FPGA) IC from AMD designed for industrial-grade embedded applications. It combines a sizable logic fabric with on-chip memory and flexible I/O in a compact 324‑LFBGA (324‑CSPBGA, 15×15) package.

Key device characteristics include 52,160 logic elements, approximately 2.76 Mbits of embedded memory, 150 user I/O pins, a low-voltage core supply range (0.95 V–1.05 V), and a specified operating temperature range of -40°C to 100°C.

Key Features

  • Core / Logic  4,075 configurable logic blocks (CLBs) delivering a total of 52,160 logic elements for implementing custom digital functions and state machines.
  • Embedded Memory  Approximately 2.76 Mbits of on‑chip RAM to support data buffering, FIFOs, and on‑chip storage for user logic.
  • I/O and Package  150 user I/O pins in a 324‑LFBGA (324‑CSPBGA, 15×15) surface‑mount package, enabling compact board implementations with extensive external connectivity.
  • Power  Core supply voltage range of 0.95 V to 1.05 V to match standard low‑voltage power rails used in modern embedded systems.
  • Temperature and Grade  Industrial grade device rated for operation from -40°C to 100°C for deployment in temperature‑sensitive environments.
  • Mounting and Compliance  Surface mount package with RoHS compliance for streamlined manufacturing and regulatory alignment.

Unique Advantages

  • High logic density: 52,160 logic elements provide substantial resources for implementing complex custom logic without external ASICs or CPLDs.
  • Substantial on‑chip memory: Approximately 2.76 Mbits of embedded RAM reduces reliance on external memory for buffering and algorithm state.
  • Compact, production‑ready package: 324‑LFBGA (324‑CSPBGA, 15×15) offers a space‑efficient footprint suitable for dense board designs.
  • Industrial temperature rating: −40°C to 100°C operating range supports deployment in harsh or temperature‑variable installations.
  • Low‑voltage core operation: 0.95 V–1.05 V supply compatibility aligns with modern low‑power system architectures.
  • RoHS compliant: Meets lead‑free manufacturing requirements for global production processes.

Why Choose XC7A50T-1CSG325I?

The XC7A50T-1CSG325I positions itself as a versatile Artix‑7 FPGA option for industrial and embedded designers who need a balanced combination of logic capacity, embedded memory, and I/O in a compact, surface‑mount package. Its industrial temperature rating and RoHS compliance make it suitable for long‑life production deployments where environmental resilience and manufacturing compliance matter.

With a documented core supply range and clear device resource counts, this FPGA is well suited for teams implementing custom digital signal processing, control logic, or interface bridging where predictable resource availability and a compact footprint are priorities. Documentation for the Artix‑7 family is available to support design integration and validation.

If you would like pricing, availability, or a formal quote for XC7A50T-1CSG325I, submit a request or inquiry and a representative will respond with details to support your procurement and design planning.

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