XC7A50T-1FTG256C

IC FPGA 170 I/O 256FTBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 170 2764800 52160 256-LBGA

Quantity 1,181 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package256-FTBGA (17x17)GradeCommercialOperating Temperature0°C – 85°C
Package / Case256-LBGANumber of I/O170Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs4075Number of Logic Elements/Cells52160
Number of GatesN/AECCNEAR99HTS Code8542.39.0001
QualificationN/ATotal RAM Bits2764800

Overview of XC7A50T-1FTG256C – Artix-7 FPGA, 170 I/O, 256-LBGA

The XC7A50T-1FTG256C is an Artix‑7 field programmable gate array (FPGA) IC designed for applications that require programmable digital logic and flexible I/O in a compact surface-mount package. It provides a combination of logic capacity, embedded memory and a low-voltage core supply suitable for commercial-temperature designs.

Key Features

  • Core Logic  Approximately 52,160 logic elements for implementing custom digital logic and control functions.
  • Embedded Memory  Approximately 2.76 Mbits of on‑chip RAM to support buffers, FIFOs and local data storage.
  • I/O Capacity  170 general-purpose I/O pins to interface with peripherals, sensors and external devices.
  • Power  Core voltage supply range from 0.95 V to 1.05 V to support low-voltage FPGA core operation.
  • Package & Mounting  256‑LBGA (supplier package: 256‑FTBGA, 17×17) in a surface-mount form factor for compact PCB designs.
  • Operating Range & Grade  Commercial grade device rated for 0 °C to 85 °C operation.
  • RoHS Compliant  Manufactured in compliance with RoHS requirements.

Typical Applications

  • Embedded Systems  Implement custom logic, protocol handling and peripheral interfacing where programmable hardware acceleration is required.
  • Prototyping & Development  Rapidly iterate digital designs and validate hardware concepts using a reprogrammable logic fabric.
  • Communications & I/O Bridging  Use the device’s I/O capacity to aggregate, translate or route signals between subsystems.

Unique Advantages

  • High Logic Density: The device’s ~52k logic elements allow consolidation of multiple functions into a single programmable device, reducing component count.
  • Significant On‑Chip Memory: Approximately 2.76 Mbits of embedded RAM supports local buffering and data handling without external memory.
  • Generous I/O Count: 170 I/Os simplify board-level interfacing and reduce the need for external multiplexing or expanders.
  • Compact, Industry‑Standard Package: 256‑LBGA (256‑FTBGA 17×17) surface-mount package enables dense PCB layouts for space‑constrained designs.
  • Low‑Voltage Core Operation: Core supply range of 0.95–1.05 V supports efficient power delivery for modern FPGA operation.
  • Commercial Temperature Rating: Specified 0 °C to 85 °C operation for mainstream electronic applications and products.

Why Choose XC7A50T-1FTG256C?

The XC7A50T-1FTG256C delivers a balanced mix of logic capacity, embedded memory and flexible I/O in a compact 256‑LBGA surface-mount package. Its low-voltage core and commercial temperature rating make it suitable for a wide range of mainstream electronic designs that need programmable hardware, on‑chip memory resources and substantial I/O integration.

This device is well suited to designers and teams seeking a scalable, reprogrammable solution that consolidates multiple digital functions into a single IC, helping to simplify BOM, reduce board complexity and accelerate development cycles.

If you would like pricing, availability or to request a quote for the XC7A50T-1FTG256C, please submit a request and our team will respond with a tailored quote and next steps.

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