XC7A50T-1FGG484I
| Part Description |
Artix-7 Field Programmable Gate Array (FPGA) IC 250 2764800 52160 484-BBGA |
|---|---|
| Quantity | 1,064 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 250 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 4075 | Number of Logic Elements/Cells | 52160 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 2764800 |
Overview of XC7A50T-1FGG484I – Artix‑7 Field Programmable Gate Array (FPGA), 484‑BBGA
The XC7A50T-1FGG484I is an Artix‑7 FPGA IC from AMD designed for applications requiring mid‑range programmable logic capacity in a compact BGA package. It combines 52,160 logic elements with approximately 2.76 Mbits of embedded memory and up to 250 general‑purpose I/O to enable custom digital functions and interface consolidation.
Key device attributes include a 484‑ball BGA package (supplier package: 484‑FBGA, 23×23), a low‑voltage core supply range of 0.95 V to 1.05 V, surface‑mount mounting, RoHS compliance, and industrial temperature operation from ‑40 °C to 100 °C.
Key Features
- Core & logic density 52,160 logic elements provide substantial programmable logic capacity for mid‑range FPGA designs.
- Embedded memory Approximately 2.76 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage.
- I/O and package Up to 250 user I/O pins in a 484‑ball BGA package (supplier package: 484‑FBGA, 23×23) for flexible external interfacing.
- Power supply Core voltage supply range of 950 mV to 1.05 V to match typical low‑voltage FPGA power domains.
- Temperature & grade Industrial grade device with an operating temperature range of ‑40 °C to 100 °C for demanding environments.
- Mounting & compliance Surface‑mount package and RoHS compliance to support standard PCB assembly and environmental requirements.
Typical Applications
- Industrial control systems Industrial temperature rating and a high I/O count support control, monitoring, and interface tasks in industrial equipment.
- Embedded processing Combined logic density and embedded memory enable custom signal processing and control functions in embedded platforms.
- Interface consolidation Up to 250 I/O pins allow designers to implement multiple protocol bridges and custom peripheral interfaces within a single device.
Unique Advantages
- High programmable logic capacity: 52,160 logic elements reduce the need for multiple discrete logic devices by integrating substantial logic on‑chip.
- Significant on‑chip memory: Approximately 2.76 Mbits of embedded RAM supports local buffering and data‑path acceleration without external memory.
- Flexible I/O in a compact package: 250 I/O pins in a 484‑ball BGA (23×23) package provide a balance of connectivity and board‑space efficiency.
- Industrial temperature capability: Rated from ‑40 °C to 100 °C, suitable for deployment in temperature‑sensitive industrial environments.
- Low‑voltage core operation: 0.95 V to 1.05 V core supply supports modern low‑power system architectures.
- RoHS compliant and surface mount: Supports standard manufacturing and environmental compliance requirements.
Why Choose XC7A50T-1FGG484I?
The XC7A50T-1FGG484I positions itself as a mid‑range Artix‑7 FPGA option that balances logic capacity, on‑chip memory, and I/O count within a compact 484‑ball BGA footprint. Its industrial temperature rating and RoHS compliance make it suitable for deployed systems requiring dependable operation across a wide temperature range.
This device is well suited for designers who need to consolidate interfaces, implement custom digital processing, or replace multiple discrete components with a single programmable device while maintaining a small board footprint and adhering to industrial environmental requirements.
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